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Staff Design Engineer Jobs

190 Job Offers

Staff Package Design Engineer
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Renesas seeks a Staff Package Design Engineer in Bengaluru with 6+ years of CAD layout experience in 2.5D/3D IC, FCBGA and SiP packages. Proficiency in Cadence Allegro or Siemens Xpedition required.
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Renesas Electronics
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(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die (Experienced in Power or Gan is requried)
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Renesas seeks a Senior Staff Package Design Engineer in Suzhou to develop power SiP, wafer-level and flip-chip packaging. Requires 10+ years in package development, GaN and OSAT/CM experience.
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Renesas Electronics
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(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die (Experienced in Power or Gan is requried)
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Renesas seeks a Senior Staff Package Design Engineer in Kaohsiung to develop power SiP/module, wafer-level and flip-chip packaging. Requires 10+ years experience, GaN knowledge a plus.
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Renesas Electronics
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(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die (Experienced in Power or Gan is requried)
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Renesas seeks a Senior Staff Package Design Engineer in Taipei to develop power SiP/module, wafer-level and flip-chip packaging. Requires 10+ years of package development experience and strong GaN or power expertise.
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Renesas Electronics
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(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die (Experienced in Power or Gan is requried)
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Senior Staff Package Design Engineer role in Shanghai requiring 10+ years in power SiP/module, wafer level and flip-chip packaging. Lead OSAT/CM qualification, DOE process optimization and new package qualification for consumer, industrial and automotive power applications.
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Renesas Electronics
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Staff Package Design Engineer
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Lead cutting-edge semiconductor packaging innovation in Bayan Lepas. Design PowerQFN, Flip-Chip and SiP solutions for AI/HPC markets. Requires 5-15 years package development experience and engineering degree.
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Renesas Electronics
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(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die (Experienced in Power or Gan is requried)
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Renesas seeks a Senior Staff Package Design Engineer in Taichung to develop power SiP, wafer-level and flip-chip packaging. Requires 10+ years in package development, GaN and power module expertise, plus strong OSAT/CM collaboration skills.
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Renesas Electronics
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Staff Package Design Engineer - MIS substrate/FC expose die ( Experienced in Power or Gan is requried )
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Renesas seeks a Staff Package Design Engineer in Taipei to develop power SiP, wafer-level and flip-chip packaging. Requires 10+ years in package development, strong analytical skills and GaN knowledge is a plus.
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Renesas Electronics
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Sr. Staff Engineer - Physical Design
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Renesas seeks a Sr. Staff Engineer in Bengaluru with 10+ years of physical design experience. Drive RTL-to-GDSII, PPA optimization, and timing closure using Fusion Compiler, Innovus, and Primetime.
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Renesas Electronics
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Sr Staff Engineer – Analog/Mixed Signal Design
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Renesas seeks a Sr Staff Engineer in Bengaluru to architect and deliver high-performance analog/mixed-signal IPs. Requires 10+ years of IC design experience and full lifecycle ownership from specification to silicon validation.
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Renesas Electronics
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Staff/ Senior Staff /Principal Engineer, Analog Design (Power & Analog ICs)
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Renesas seeks a Staff/Principal Analog Design Engineer in Bengaluru to architect complex power-management ICs, PMICs, and mixed-signal blocks. Requires 6-15 years of analog design expertise with hands-on PMIC and converter experience.
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Renesas Electronics
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Senior Staff Engineer – Analog/Mixed Signal Design
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Renesas seeks a Senior Staff Engineer in Bengaluru to architect and deliver high-performance analog/mixed-signal IPs. Requires 10+ years of IC design experience and full lifecycle ownership from specification to silicon validation.
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Renesas Electronics
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Sr Staff Digital Design Engineer
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Senior digital design role in Catania for an engineer with 8-12 years of experience and EE/ECE degree. Work on advanced power management ICs, leading RTL design, verification and automation with Verilog and SystemVerilog.
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Renesas Electronics
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Staff Layout Design Engineer
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Experienced Staff Layout Design Engineer needed in Sophia Antipolis to work on DC-DC converters, controllers and drivers. Requires 6+ years in Analog Layout Design, DRC/LVS flows and full chip ownership.
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France, Sophia Antipolis
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Renesas Electronics
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Staff Mask Design Engineer
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Experienced Staff Mask Design Engineer needed in Chandler to lead analog and mixed-signal IC layout for automotive applications. Requires 8+ years of layout experience, advanced CMOS BCD expertise, and strong physical verification skills.
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Renesas Electronics
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Staff Package Design Engineer
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Renesas seeks a Staff Package Design Engineer in Tempe, AZ to design advanced packages (FCBGA, SiP, WLCSP, power modules). Requires 4+ years CAD layout experience and strong OSAT/substrate collaboration skills.
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Renesas Electronics
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Senior Staff AMS Design Verification Engineer
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Lead AMS design verification at Renesas in Bengaluru. Requires 10+ years in advanced verification, UVM, SystemVerilog, and mixed-signal tools like Cadence Virtuoso and xCelium. Drive first-pass silicon success.
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Staff Design Verification Engineer
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Renesas seeks a Staff Design Verification Engineer in Duluth to verify advanced DDR6 memory interface products for data center and AI. Requires 8+ years in semiconductor verification, strong SystemVerilog and UVM skills.
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Renesas Electronics
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Senior Staff Design Verification Engineer
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Renesas seeks a Senior Staff Design Verification Engineer in Duluth to lead verification of advanced memory interface products for data center and AI. Requires 10+ years in semiconductor verification, SystemVerilog and UVM expertise.
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Renesas Electronics
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Staff / Senior Staff Engineer, Analog Design (Power & Analog ICs)
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Renesas Electronics
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