Manufacturing jobs in Japan

Senior Analog Engineer role in Toyosu designing Power Management ICs. Requires ~10 years of analog/mixed-signal IC design experience, switching converters, Power FETs, gate drivers, ADCs, DACs, and LDOs. Ultra-low IQ and high-voltage design preferred.

Lead advanced semiconductor packaging development for AI/HPC, automotive and IoT applications. Drive FCCSP and FCBGA process innovation, from molding to PKG saw, supporting production launch and yield improvement in Nakatsu.

Senior process engineer role in Kai focused on 300mm wafer thermal diffusion, oxidation, LPCVD or cleaning and wet etching. Requires 3+ years of relevant experience, semiconductor engineering knowledge, and business-level Japanese with TOEIC 600 English.

Seeking a Power Device Development Engineer to drive 200mm to 300mm wafer enlargement and process development for automotive and AI semiconductors. Requires 3+ years of device structure design or process development experience. Based in Kai.