Engineering jobs in China

Renesas seeks a Senior Staff Package Design Engineer in Suzhou to develop power SiP, wafer-level and flip-chip packaging. Requires 10+ years in package development, GaN and OSAT/CM experience.

Senior Staff Package Design Engineer role in Shanghai requiring 10+ years in power SiP/module, wafer level and flip-chip packaging. Lead OSAT/CM qualification, DOE process optimization and new package qualification for consumer, industrial and automotive power applications.

Join WD as a Staff Mechanical Engineer in Shenzhen, developing precision testing units and automation equipment for AI-driven data infrastructure. Requires a Master's in mechanical engineering, Solidworks skills, and global team collaboration.