This list contains only the countries for which job offers have been published in the selected language (e.g., in the French version, only job offers written in French are displayed, and in the English version, only those in English).
Senior Engineer, Software Development Engineering (Apps)
Join our team in Bengaluru as a Senior Software Development Engineer (Apps). Lead the creation of innovative, scalable mobile and cloud applications using Java, Python, or C++. Drive technical excellence, mentor junior developers, and work within Agile methodologies in a dynamic environment.
Location
India , Bengaluru
Salary
Not provided
Sandisk
Expiration Date
Until further notice
Staff Engineer, Systems Design Engineering
Location
India , Bengaluru
Salary
Not provided
Sandisk
Expiration Date
Until further notice
Performance Architect
Location
United States , Milpitas
Salary
136537.00 - 193442.00 USD / Year
Sandisk
Expiration Date
April 28, 2026
Staff Engineer, Systems Design Engineering
Join Western Digital in Bengaluru as a Staff Engineer in Systems Design. You will architect and validate storage systems, requiring 6-8 years' experience in hardware/firmware design and strong debugging skills. This role focuses on power analysis, BOM review, and delivering high-quality storage s...
Location
India , Bengaluru
Salary
Not provided
Sandisk
Expiration Date
Until further notice
Senior Engineer, Packaging Engineering
Location
Malaysia , Batu Kawan
Salary
Not provided
Sandisk
Expiration Date
Until further notice
Staff Engineer, Failure Analysis Engineering
Location
Korea, Republic of , Seoul
Salary
Not provided
Sandisk
Expiration Date
Until further notice
Principal Engineer, VLSI Design Engineering
Location
India , Bengaluru
Salary
Not provided
Sandisk
Expiration Date
Until further notice
Packaging Engineer (Substrate Design and Layout)
Join our team in Taichung as a Packaging Engineer specializing in Substrate Design and Layout. You will optimize die bonding and substrate layouts for ASIC and SiP solutions, including SSD controllers and NAND BGA. The role involves advanced packaging tech like FCBGA and 2.5D, using Cadence and A...
Location
Taiwan , Taichung
Salary
Not provided
Sandisk
Expiration Date
Until further notice
New College Graduate Engineer, Sr. Test Engineering