Renesas Electronics - Malaysia, Bayan Lepas, On-site work

Financial Analyst role in Bayan Lepas requiring 3-5 years of experience in financial analysis, reconciliation, and reporting. Proficiency in Excel, SAP, and EPM systems essential. Japanese language skills are a plus for this detail-oriented position.

Join as a Product & Test Engineer in Bayan Lepas to drive automotive semiconductor manufacturing. Support new product introductions, improve test yield and quality, and collaborate with cross-functional teams. Fresh graduates welcome.

Lead a team of five analysts as Finance Supervisor in Bayan Lepas. Requires 6-10 years in financial analysis, reporting, and people leadership with strong Power BI or Tableau, Excel, SAP, and EPM skills.

Equipment Engineer role in Bayan Lepas focused on plating and wet process equipment reliability. Requires engineering degree, 2+ years semiconductor maintenance experience, and strong OEE and troubleshooting skills.

Lead Product & Test Engineering in Bayan Lepas, driving NPI, product transfer and high-volume semiconductor manufacturing. Requires 15+ years in test engineering, 5 in leadership, and ATE expertise (V93000, J750).

Lead semiconductor product and test engineering in Bayan Lepas. Drive yield, OEE, and cost improvements while owning ATE test programs and final test operations. Requires 6+ years in high-volume semiconductor manufacturing.

Lead ATE hardware solutions for Renesas' AI semiconductor portfolio in Bayan Lepas. Requires 7-12 years in semiconductor ATE hardware design, module test handling, and power device expertise. Drive NPI and mass production success.

Join our team as a Product & Test Engineer in Bayan Lepas! Support semiconductor testing, improve yield and quality, and drive continuous improvement. Requires a degree in EE/Electronics and strong analytical skills.

Hardware Test Engineer in Bayan Lepas to manage ATE hardware vendors, budgets, and production releases. Requires 3+ years in semiconductor ATE hardware, schematic reading, and PCB layout skills.

Senior Product Testing Engineer role in Bayan Lepas driving yield enhancement and test cost reduction. Requires 3+ years in high-volume semiconductor manufacturing, strong data analysis skills (JMP, Spotfire) and cross-functional collaboration.

Lead cutting-edge semiconductor packaging innovation in Bayan Lepas. Design PowerQFN, Flip-Chip and SiP solutions for AI/HPC markets. Requires 5-15 years package development experience and engineering degree.

Lead semiconductor product and test engineering for high-volume manufacturing in Bayan Lepas. Requires 10+ years with ATE platforms, yield optimization, and cross-functional leadership. Drive NPI, test program robustness, and cost improvements.