Renesas Electronics - Japan, On-site work

Lead semiconductor package electrical design in Kodaira, collaborating with IC engineers to optimize cost and performance. Requires 3+ years in package design, HFSS/Q3D, ADS/HSPICE, and VNA characterization.

Senior Analog Engineer role in Toyosu designing Power Management ICs. Requires ~10 years of analog/mixed-signal IC design experience, switching converters, Power FETs, gate drivers, ADCs, DACs, and LDOs. Ultra-low IQ and high-voltage design preferred.

Develop next-generation GaN power conversion technologies in Hitachinaka. Design advanced device structures, drive process integration, and perform electrical characterization. Requires 3-7 years in semiconductor device development and strong English skills.

Senior Global HRBP role at Renesas in Toyosu supporting Operations leadership. Requires 5-10 years HR experience, strong analytics and Excel skills, and ability to influence VP-level stakeholders in a global matrixed organization.

Lead PMIC evaluation and PCB design in Toyosu. Drive silicon validation, bench automation, and technical documentation while supporting customers and design teams. Hands-on power management role with real technical impact.

Lead advanced semiconductor packaging development for AI/HPC, automotive and IoT applications. Drive FCCSP and FCBGA process innovation, from molding to PKG saw, supporting production launch and yield improvement in Nakatsu.

Design next-gen lithium-ion battery control ICs as an Analog Circuit Design Engineer in Takasaki. Requires 3+ years analog design, Cadence Virtuoso, and BCD process (30-100V) expertise.

Lead power IC evaluation projects in Toyosu as Staff Application Engineer. Requires PMIC evaluation, PCB design, bench debugging and automation skills. Create technical docs and support customers.

Semiconductor Layout & Tape-Out Engineer role in Kodaira requiring Cadence, Calibre, and Unix/Linux skills for GaN tape-out execution. Japanese proficiency essential for global collaboration.

Develop automated test systems for automotive MCU/SoC products in Kodaira. Requires 5+ years in semiconductor testing, test specification design, and programming-driven process improvement. Drive scalable, high-quality test workflows.

Seeking a GaN Technology Development Engineer in Hitachinaka to drive next-generation high-efficiency power conversion. Requires a B.S. or above in EE or Semiconductor Physics, 3-7 years of device development experience, and hands-on electrical characterization skills.

Senior procurement role in Toyosu sourcing software, SaaS, cloud services, IP licensing and outsourcing. Requires 2+ years in purchasing or vendor management, strong negotiation and contract skills, plus cross-functional coordination with legal, security and finance teams.