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Renesas Electronics - Japan, Manufacturing

64 Job Offers

Job Offers

CPU Subsystem Development

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Lead CPU Subsystem development for next-gen microcontrollers in Kodaira. Drive architecture, RTL design, verification, and functional safety while optimizing performance, power, and area. Collaborate globally on high-performance CPUSS solutions.
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【茨城】半導体前工程 生産設備保全員(2)

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Join a dynamic team in Hitachinaka as a Semiconductor Production Equipment Maintenance Technician. Leverage your maintenance expertise to ensure stable operations and drive improvements in a globally focused company.
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Japan, Hitachi-Naka
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Sr Test Engineer, MPU/SoC

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Senior Test Engineer for MPU/SoC production test development in Kodaira. Requires 5+ years semiconductor test experience with T2000 and J750 (IG-XL) ATE platforms, DFT skills, and Python automation. Japanese business level required.
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Renesas Electronics
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【茨城】半導体前工程 生産設備保全員(2)

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Semiconductor equipment maintenance role in Hitachinaka: repair, service and improve fab tools to keep production stable. Requires related experience, teamwork and communication skills. Electrical, mechanical or engineering background welcome.
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Japan, Hitachi-Naka
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Sr Staff Analog Engineer

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Senior Analog Engineer role in Toyosu designing Power Management ICs. Requires ~10 years of analog/mixed-signal IC design experience, switching converters, Power FETs, gate drivers, ADCs, DACs, and LDOs. Ultra-low IQ and high-voltage design preferred.
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Process Engineer

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Lead advanced semiconductor packaging development for AI/HPC, automotive and IoT applications. Drive FCCSP and FCBGA process innovation, from molding to PKG saw, supporting production launch and yield improvement in Nakatsu.
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Sr. Engineer

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Senior process engineer role in Kai focused on 300mm wafer thermal diffusion, oxidation, LPCVD or cleaning and wet etching. Requires 3+ years of relevant experience, semiconductor engineering knowledge, and business-level Japanese with TOEIC 600 English.
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【300mm】パワーデバイス開発エンジニア

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Seeking a Power Device Development Engineer to drive 200mm to 300mm wafer enlargement and process development for automotive and AI semiconductors. Requires 3+ years of device structure design or process development experience. Based in Kai.
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Principal Engineer, Analog / Mixed-Signal IC Design

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Semiconductor Assembly Process Development Engineer

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Engineer

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Cybersecurity Requirement Management

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