Unit Process Engineer Job at NHanced Semiconductors (Odon)

Job Responsibility

Lead and execute demonstrations of flows and technology qualifications for new product introductions, focusing on one or more of the following process modules: Dielectric Film Deposition and Etch (CVD, PECVD, Dry Etch, Ashing)
Advanced Packaging and Assembly (Wafer-Level, Flip-Chip, Die Attach)
Metrology and Characterization (CD, Film Thickness, Roughness, Inline Defect Inspection)
Electrical Test (Parametric Test, Final Test, Reliability Evaluation)
Own and maintain process operation specifications, process windows, and control plans
Develop and implement Statistical Process Control (SPC) charts to monitor and maintain process stability and capability
Monitor daily wafer lot flow across multiple unit processes
Maintain real-time awareness of tool and process status
Maintain precise, comprehensive documentation of process conditions, experimental setups, deviations, and outcomes
Perform data analysis using statistical tools
Identify trends and implement process improvements that enhance product performance, reduce variation, and improve yield
Work with equipment engineers and cross-functional teams to resolve process deviations, tool issues, and integration challenges
Lead root cause analysis investigations for process excursions and drive corrective action implementation
Contribute to recipe development and optimization for next-generation and current product platforms
Participate in cross-site technology transfer, process benchmarking, and best-practice alignment

US citizenship
Bachelor’s degree (or higher) in engineering, science, or related discipline
5+ years of hands-on experience in a semiconductor fabrication environment with direct ownership of process modules
Experience working with cross-functional and multi-site teams including integration, equipment, and yield engineers
Experience with precision tools and characterization equipment
Must be able to wear cleanroom attire, including protective eye gear for up to 8 hours per day
Must be able to sit, bend, stand, walk, 8 hours per day
Must be able to lift and transport equipment/materials up to 35 lbs.
Must be able to work flexible hours based on company needs

Proven ability to operate independently and collaboratively across technical and organizational boundaries
Strong technical writing, documentation, and presentation skills
Comfortable communicating at all levels — from operators to senior management
Adaptable and open to evolving responsibilities in a dynamic startup or R&D-heavy environment
High standard for reliability, attendance, and attention to detail
Flexible
willing to learn and grow in a startup environment
Expertise in troubleshooting and resolving complex process and equipment issues in unit processes
Strong understanding of semiconductor process flows and unit process interactions
Familiarity with process integration tradeoffs and interaction between lithography, deposition, etch, and CMP modules
Proficiency in DOE design and analysis, SPC implementation, and process window characterization
Skilled in use of process metrology tools (e.g., SEM, ellipsometry, profilometry, XRF, CD-SEM, AFM, etc.)
Able to generate and interpret technical documentation including process specs, maintenance manuals, safety protocols, and operating procedures
Knowledge of chemical and laboratory safety procedures and compliance standards