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Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape. Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality. Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.
Job Responsibility:
Be responsible for Die Prep equipment day to day line sustaining, PM and conversion
Requirements:
Certificate / Diploma in Electrical & Electronic / Mechatronic or Equivalent
1~3 years of equipment engineering experience in Wafer soft test equipment maintenance
Able to do troubleshooting and maintenance at Die Prep equipment, hands on and provide systematic problem analysis
Able to perform Preventive maintenance, conversion. and quality improvement projects
Ability to troubleshoot, analyze complex problems and 5 WHY analysis
Experience in PM and major down troubleshooting
Responsible to liaise with process engineering team for low yield triggering
Be available for overtime work as of when needed
Nice to have:
Knowledge in Backgrind, wafer saw and Taping will be added advantage
Die Prep equipment maintenance and troubleshooting skill, wafer handling skill and involve in some improvement project