Staff Photonics Packaging Engineer Jobs

Aeva

Location:
Germany

Category:
IT - Software Development

Contract Type:
Not provided

Salary:

Not provided

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Job Description:

We are looking for a Photonics Integration Engineer with cross functional expertise in delivering photonics to various product lines. Aeva’s mission is to bring the next wave of perception to a broad range of applications from automated driving to industrial robotics, consumer electronics, consumer health, security, and beyond.

Job Responsibility:

Deliver photonics packaging solutions for various LiDAR & sensing product lines
Define characterization to assess impacts from packaging to photonic components
Drive characterization of photonics to solve system integration challenges
Drive validation through the product development cycle

Requirements:

5+ years of experience with Photonics Packaging
10 years’ experience with delivering integrated packages for photonics chipsets to product
Experience with 5 years or more of photonics packaging
Experience with laser integration on chip including design trade offs, process flows, test and reliability
Experience with multi-channel, multiwavelength laser integration including single and multi-emitter configuration and corresponding photonics requirements
Experience with photonics packaging with electronics with an emphasis on advanced packaging technologies such as flip chip integration, FOWLP and BGA packages
Experience working cross functionally to resolve challenges during product integration
Strong presentation, communication skills and results orientation
Experience with working with cross functional teams to deliver cutting edge products

What we offer:

Very competitive compensation and meaningful stock grants
Exceptional benefits: Medical, Dental, Vision, and more
Unlimited PTO

Additional Information:

Job Posted:
December 05, 2025

Employment Type:

Fulltime

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Staff Photonics Packaging Engineer