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Staff Engineer, Technology Development Quality & Reliability

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Sandisk

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Location:
Malaysia, Batu Kawan, Penang

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Category:
IT - Software Development

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Contract Type:
Not provided

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Salary:

Not provided

Job Description:

The Staff Engineer defines, develops and qualifies new semiconductor packages and maintains quality of existing packages. Represents Package Engineering in cross-functional teams and ensures that packages are characterized, qualified and introduced into production in a timely manner while meeting all electrical, performance, reliability and quality requirements. Take responsibility for product DPPM, as well as new Technology development programs and new NAND/ASIC development Quality and Reliability. Develop a comprehensive quality guidance library encompassing engineering work criteria, statistical Design of Experiments (DOE), Scorecard, sampling plans, and metric/methodology instructions. Address quality cases in technology and product development using DMAIC, RCA, and 8DR methodologies. Coordinates with factories worldwide on the high-volume introduction of new packages and assembly processes. Manages assembly yield improvement and package cost reduction programs.

Job Responsibility:

  • Defines, develops and qualifies new semiconductor packages and maintains quality of existing packages
  • Represents Package Engineering in cross-functional teams and ensures packages are characterized, qualified and introduced into production in a timely manner while meeting all electrical, performance, reliability and quality requirements
  • Take responsibility for product DPPM, as well as new Technology development programs and new NAND/ASIC development Quality and Reliability
  • Develop a comprehensive quality guidance library encompassing engineering work criteria, statistical Design of Experiments (DOE), Scorecard, sampling plans, and metric/methodology instructions
  • Address quality cases in technology and product development using DMAIC, RCA, and 8DR methodologies
  • Coordinates with factories worldwide on the high-volume introduction of new packages and assembly processes
  • Manages assembly yield improvement and package cost reduction programs

Requirements:

  • MS / PhD degree in Mechanical/Materials Engineering
  • Knowledge of semiconductor packaging highly desired
  • Working knowledge of AutoCAD, Cadence APD, Finite Element Analysis, Design of Experiments, statistical techniques and package failure analysis techniques required
  • Ability to multi-task and meet tight deadlines
  • Excellent communication and interpersonal skills required
  • Preferred candidate will have worked on projects related to semiconductor packaging from both mechanical and electrical integrity perspective

Additional Information:

Job Posted:
December 11, 2025

Employment Type:
Fulltime
Work Type:
On-site work
Job Link Share:
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