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The Staff Engineer defines, develops and qualifies new semiconductor packages and maintains quality of existing packages. Represents Package Engineering in cross-functional teams and ensures that packages are characterized, qualified and introduced into production in a timely manner while meeting all electrical, performance, reliability and quality requirements. Take responsibility for product DPPM, as well as new Technology development programs and new NAND/ASIC development Quality and Reliability. Develop a comprehensive quality guidance library encompassing engineering work criteria, statistical Design of Experiments (DOE), Scorecard, sampling plans, and metric/methodology instructions. Address quality cases in technology and product development using DMAIC, RCA, and 8DR methodologies. Coordinates with factories worldwide on the high-volume introduction of new packages and assembly processes. Manages assembly yield improvement and package cost reduction programs.
Job Responsibility:
Defines, develops and qualifies new semiconductor packages and maintains quality of existing packages
Represents Package Engineering in cross-functional teams and ensures packages are characterized, qualified and introduced into production in a timely manner while meeting all electrical, performance, reliability and quality requirements
Take responsibility for product DPPM, as well as new Technology development programs and new NAND/ASIC development Quality and Reliability
Develop a comprehensive quality guidance library encompassing engineering work criteria, statistical Design of Experiments (DOE), Scorecard, sampling plans, and metric/methodology instructions
Address quality cases in technology and product development using DMAIC, RCA, and 8DR methodologies
Coordinates with factories worldwide on the high-volume introduction of new packages and assembly processes
Manages assembly yield improvement and package cost reduction programs
Requirements:
MS / PhD degree in Mechanical/Materials Engineering
Knowledge of semiconductor packaging highly desired
Working knowledge of AutoCAD, Cadence APD, Finite Element Analysis, Design of Experiments, statistical techniques and package failure analysis techniques required
Ability to multi-task and meet tight deadlines
Excellent communication and interpersonal skills required
Preferred candidate will have worked on projects related to semiconductor packaging from both mechanical and electrical integrity perspective
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