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The job is in charge of electrical failure analysis (eFA) on eMMC/UFS/SD card products. The individual has to find out the failure mechanism, narrow down the problematic circuitry, trigger conditions, and develop correlative action to improve product quality. The individual must develop correlated test item or production enhancement base on the failure symptom. Individuals must have good communication skills and teamwork attitude to coordinate between memory designers, production engineer, testing engineer, and FW team to deliver quality improvement solutions. Product includes eMMC, UFS, & SD card across consumer, industrial, & automotive grades.
Job Responsibility:
Electrical failure analysis (eFA) on eMMC/UFS/SD card products
Find out the failure mechanism, narrow down the problematic circuitry, trigger conditions, and develop correlative action to improve product quality
Develop correlated test item or production enhancement base on the failure symptom
Coordinate between memory designers, production engineer, testing engineer, and FW team to deliver quality improvement solutions
Requirements:
Master’s degree in Electrical Engineering or related fields + Working experiment on NAND relative industry for at least 3 years
or Bachelor's degree + 5 years Working experiment
Good knowledge at Semiconductor process, device physics, and microelectronics
Familiar with C programming language is mandatory
English conversation ability is mandatory and Good English comprehension (written and verbal)
A proven desire to work as a team member, both on the same team and outside of the team
Ability to troubleshoot and analyze complex problems
Ability to multi-task and meet deadlines
Good communication and interpersonal skills
Nice to have:
NAND flash knowledge and experience
Product engineer or testing engineer background will be a plus