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Reality Labs is focused on ensuring the highest quality and reliability of our advanced silicon products. We are seeking a Lead Silicon Reliability Engineer to drive reliability strategies and lead efforts to deliver robust silicon solutions.
Job Responsibility:
Lead the development, execution, and continuous improvement of silicon reliability qualification strategies aligned with industry standards and customer requirements
Act as the technical authority, holding in-depth subject-matter knowledge for silicon reliability across the organization
Collaborate with suppliers, product engineering, design, packaging, process, and test teams to influence design-for-reliability early in product development
Work with development partners and OSATs to align qualification methodologies and reliability expectations
Define and oversee reliability test plans including HTOL, HAST, TC, HTS, EM, TDDB, NBTI, and other stress tests
Lead failure analysis and root cause investigations using advanced tools such as TEM, SEM, FIB, and EMMI
Work with suppliers to ensure complete and accurate documentation of reliability test plans, procedures, and reports
Contribute to internal training and knowledge sharing
Requirements:
M.S. in Electrical Engineering, Materials Science, Physics, or related field with 8+ years of relevant work experience
Proven leadership in silicon reliability for high-volume consumer, automotive, or high-performance computing products
Demonstrated understanding of CMOS device physics, aging mechanisms (NBTI, HCI, TDDB), failure analysis techniques, and reliability modeling
In-depth knowledge of JEDEC and other relevant industry standards
Hands-on experience with statistical data analysis tools
Proven communication and leadership skills in influencing cross-functional teams and upper management
Nice to have:
15+ years of experience in semiconductor reliability engineering, with a focus on advanced silicon technologies
Experience in semiconductor device physics research and reliability modeling
Experience working with foundries (e.g., TSMC, Samsung, Intel) and advanced process nodes (e.g., 5nm, 3nm)
Experience in advanced packaging technologies System-in-Package, 3D, 2.5D packaging