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WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE: The Power Integrity and Signal Integrity engineering team ensures the performance of the products are met through the integration of silicon, package and platform electrical design. Singapore Signal Integrity Lab provides design support to engineering teams for both current and forward-looking product development and design optimization. THE PERSON: As a member of the Singapore SIPI team, you will be responsible for the electrical design and characterization of high-speed signaling and power delivery networks in AMD products covering package, connector and board. You will be required to communicate effectively and work in close collaboration with others in AMD as well as with AMD’s customers to ensure optimal engineering design decisions and efficient problem solving. KEY RESPONSIBILITIES: Experience in packaging, connector and board design for power & signal integrity;Experience in electrical modeling EDA tools such as Cadence, Ansys HFSS, SIwave, ADS, etc.;Experience in high-speed digital signaling interfaces such as PCIE, USB, GDDR and DDR;Experience in SI/PI simulation and processing of s-parameters;Knowledge in silicon interposer and optical interconnects simulations;Knowledge in analog characterization, electromagnetic theory and digital circuit analysis;Experience in test board design, fixtures and de-embedding methodologies is a plus;Experience in measurement tools VNA, TDR and high speed oscilloscope is a plus;Ability to collaborate and work across different functional teams and different sites;Self-driven and can work independently;> 3 years relevant experience is preferred ACADEMIC CREDENTIALS: Master’s degree is preferred LOCATION: Singapore #LI-JK1
Job Responsibility
Electrical design and characterization of high-speed signaling and power delivery networks in AMD products covering package, connector and board
Communicate effectively and work in close collaboration with others in AMD as well as with AMD’s customers to ensure optimal engineering design decisions and efficient problem solving
Requirements
Experience in packaging, connector and board design for power & signal integrity
Experience in electrical modeling EDA tools such as Cadence, Ansys HFSS, SIwave, ADS, etc.
Experience in high-speed digital signaling interfaces such as PCIE, USB, GDDR and DDR
Experience in SI/PI simulation and processing of s-parameters
Knowledge in silicon interposer and optical interconnects simulations
Knowledge in analog characterization, electromagnetic theory and digital circuit analysis
Experience in test board design, fixtures and de-embedding methodologies is a plus
Experience in measurement tools VNA, TDR and high speed oscilloscope is a plus
Ability to collaborate and work across different functional teams and different sites