CrawlJobs Logo
Meta Logo Meta · IT - Software Development

Signal Integrity Engineer, Intern

United States, Menlo Park Employment contract 6688.00 - 11467.00 USD / Month · Job Posted March 01, 2026
Apply Position
Job Link Share

Job Description

Meta is seeking a platform Signal Integrity (SI) intern to join our Infra HDRTP team. The team is responsible for designing, optimizing, and validating cutting-edge hardware platforms for Meta's rapidly expanding AI, compute, storage, and network infrastructure. As a platform SI intern, you will contribute to the design phase of NPI projects, collaborating closely with XFN team members and ODM partners. This role offers hands-on experience with state-of-the-art hardware technologies and expert mentorship from seasoned professionals within the team. Internships are twelve (12) to sixteen (16) weeks long.

Job Responsibility

  • Collaborate on the development of AI and network hardware designs and system solutions, guiding them from conceptualization to deployment
  • Contribute to defining requirements for novel solutions and spearhead the design, development, and testing of passive and active electrical interfaces in the high-speed links (224Gbps+, PCIe Gen6+, and other interfaces)
  • High-speed modeling and simulation (pre-layout and post-layout SI analysis)
  • PCB stackup analysis and AC/DC power integrity validation
  • COM and IBIS-AMI model simulation
  • Designing, developing, and testing components, as well as creating software automation for systems and products leveraging diverse technologies
  • Work in a collaborative environment across Meta, with system suppliers and ASIC suppliers, to drive Meta's requirements for development, planning, operation, and fleet deployment

Requirements

  • Currently pursuing or holding a Master's degree in Electrical Engineering, Computer Science and Engineering, or a related field
  • Demonstrated theoretical foundation and practical experience in electrical design and validation
  • Experience with computer and server system architecture
  • Proficiency in CAD software for 1)Schematic capture 2)PCB layout 3)ADS simulation

Nice to have

  • Intent to return to degree-program after the completion of the internship/co-op
  • Theoretical and practical knowledge in high speed signal integrity design and validation, as well as electromagnetic, antenna and microwave
  • Experience with board design from schematic entry to board layout and fabrication
  • Knowledge or experience in semiconductor devices, VLSI design, microelectronic device
  • Experience with standard SI/PI tools (e.g. HFSS, CST, HyperLynx, ADS, Spice)
  • Familiarity with IEEE 802.3.dj specifications as well as the COM tool
  • Practical experience with lab tools (e.g. Spectrum Analyzer, VNA, TDR, and real-time or sampling scope)
  • Demonstrated analytical and problem-solving skills, and able to work independently
Meta - All Job Offers

Looking for more opportunities?

Search for other job offers that match your skills and interests.

Suggested Tags: Frontend Developer Secretary Talent Manager Salesforce Administrator Data Analyst
Similar Jobs for

Signal Integrity Engineer, Intern

8 matching positions

Signal Integrity Engineer

Designs, analyzes, develops, modifies and evaluates electrical/electronic parts,...
Location
Location
Taiwan , Taipei
Salary
Salary:
Not provided
https://www.hpe.com/ Logo
Hewlett Packard Enterprise
Expiration Date
Until further notice
Flip Icon
Requirements
Requirements
  • Bachelor's or Master's degree in Electrical Engineering
  • Typically 2-4 years experience
  • Using electrical design tools and software packages
  • Ability to apply analytical and problem solving skills
  • Designing electronic components, integrated circuitry, and algorithms
  • Using empirical analysis, modeling and testing methodologies to validate component, circuit, and hardware designs and thermal/emissions management
  • Strong written and verbal communication skills
  • mastery in English and local language
  • Ability to effectively communicate design proposals and negotiate options
Job Responsibility
Job Responsibility
  • Designs portions of engineering solutions for electrical and electronic parts, subsystems, integrated circuitry, and algorithms
  • Develops and implements parameters and test plans for existing designs, including validation of tolerances, form/fit/function, shock and vibration, electromagnetic interference, safety, reliability, thermal generation, and system power measurements
  • Collaborates and communicates with internal and outsourced development partners on electrical hardware design and development
  • Participates as a member of project team of other electrical hardware engineers and internal and outsourced development partners to develop reliable, cost effective and high quality solutions
What we offer
What we offer
  • Health & Wellbeing benefits
  • Personal & Professional Development programs
  • Unconditional Inclusion environment
  • Comprehensive suite of benefits supporting physical, financial and emotional wellbeing
  • Fulltime
Read More
Arrow Right

Signal and Power Integrity Engineer

Signal and Power Integrity Engineer role at Hewlett Packard Enterprise focusing ...
Location
Location
United States , Chippewa Falls
Salary
Salary:
92600.00 - 213500.00 USD / Year
https://www.hpe.com/ Logo
Hewlett Packard Enterprise
Expiration Date
Until further notice
Flip Icon
Requirements
Requirements
  • Master's degree in Electrical Engineering
  • 1-5 years of experience in signal integrity and printed circuit boards development
  • Experience using electrical design tools (Spice Modeling, circuit modeling, and simulations) and software packages (HFSS, ANSYS, Allegro)
  • Experience in troubleshooting electronics circuits
  • Using empirical analysis, modeling and testing methodologies to validate component, circuit, and hardware designs and thermal/emissions management
  • Strong analytical and problem solving skills
  • Excellent written and verbal communication skills
  • Ability to effectively communicate product architectures, design proposals and negotiate options at management levels
Job Responsibility
Job Responsibility
  • Designs engineering solutions for electrical and electronic parts, subsystems, integrated circuitry, and algorithms
  • Develops and implements parameters and test plans for new and existing designs
  • Collaborates and communicates with management, internal, and outsourced development partners regarding design status, project progress, and issue resolution
  • Leads a project team of other electrical hardware engineers and internal and outsourced development partners
  • Represents the electrical hardware team for all phases of larger and more-complex development projects
  • Provides guidance and mentoring to less-experienced staff members
What we offer
What we offer
  • Health & Wellbeing benefits
  • Personal & Professional Development programs
  • Unconditional Inclusion environment
  • Comprehensive benefits suite supporting physical, financial and emotional wellbeing
  • Fulltime
Read More
Arrow Right

Senior SESA Engineer - Signalling / Comms

We are currently recruiting a Senior Systems and Safety Assurance Engineer to wo...
Location
Location
Australia , Perth
Salary
Salary:
150000.00 - 190000.00 AUD / Year
airswift.com Logo
Airswift Sweden
Expiration Date
Until further notice
Flip Icon
Requirements
Requirements
  • Bachelors Engineering – Electrical/Mechanical/Mechatronics/Civil or similar
  • 8+ years’ experience in Systems Engineering posts, ideally within signalling projects
  • Prior use of Requirements Management tools such as DOORS Classic or NG
  • Commercial / Consultative acumen – confident in communication
  • Basic understanding of Rail Safety National Law, EN5012x
  • Sound knowledge of principles associated with the INCOSE Systems Engineering Handbook or iESM Handbook
Job Responsibility
Job Responsibility
  • Producing works associated with Systems Engineering and Safety assurance
  • Safety Assurance
  • Systems Engineering
  • Requirements Management
  • System Architecture development
  • Goal Structured Notation
  • Systems Integration
  • Develop Safety Case Reports, Assurance plans, Hazard/Safety Analyses
  • Conduct requirements verification and develop test cases and procedures
  • Assist in Tender preparation
What we offer
What we offer
  • Hybrid 2 days WFH
  • Professional Development/Membership Assistance
  • Super
  • Fulltime
Read More
Arrow Right

Software Integration Engineer

Figure is an AI robotics company developing autonomous general-purpose humanoid ...
Location
Location
United States , San Jose
Salary
Salary:
150000.00 - 250000.00 USD / Year
figure.ai Logo
Figure
Expiration Date
Until further notice
Flip Icon
Requirements
Requirements
  • Strong ability to debug complex hardware/software systems and identify targeted tests that accelerate regression isolation and root-cause analysis
  • Programming experience in C++ and Python
  • Experience integrating and validating complex software systems in robotics, mechatronic, or electric vehicle environments
  • Bachelor’s or Master’s degree in Computer Science, Mechatronics, Robotics, or related field
  • Self-sufficient with strong ownership mindset
  • able to manage multiple high-impact priorities
Job Responsibility
Job Responsibility
  • Become the go to expert for our robot through hands-on testing and issue triage
  • Collaborating with Platform Software, AI, Controls, and Manufacturing teams to resolve software and system bugs and drive architectural improvements that reduce pain points
  • Lead and own test plan definition for new software and firmware features
  • Collaborate with developers and manufacturing to improve firmware, diagnostics, and self-tests, using EoL data to speed up robot bring-up
  • Validate software before its released to our internal manufacturing and service teams
  • assist teams with bring-up and troubleshooting
  • Partner with the Test Infrastructure team to add high-signal automated tests and diagnostics that catch regressions early, improve system reliability
  • Fulltime
Read More
Arrow Right

Signal Integrity and Power Integrity Engineer

Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the...
Location
Location
United States , Raleigh
Salary
Salary:
100600.00 - 199000.00 USD / Year
https://www.microsoft.com/ Logo
Microsoft Corporation
Expiration Date
Until further notice
Flip Icon
Requirements
Requirements
  • Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 1+ year(s) technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 2+ years technical engineering experience OR equivalent experience
  • MS degree with minimum 3+ years of experience in silicon/package/system signal integrity and power delivery
  • BSEE degree with minimum 5 years’ experience in silicon/package/system signal integrity and power delivery
  • Strong foundation and expert in the field of Signal and Power Integrity and delivery, System design, IP design with knowledge on product development with minimum 5 years’ experience in design and electrical modelling
  • Good working knowledge in the field of end to end system SIPI Design and Architecture
  • Industry knowledge, trends and landscape of technologies to drive development across Silicon-IP, Advanced packaging, Substrate technology, Board technology and Platform design
  • Excellent interpersonal skills including written and verbal communication, teamwork, negotiation, and presentation
  • Experience with high-speed signal design and power integrity modelling for HPC products
  • Strong foundation in advanced packaging technologies as it relates to Signal and Power integrity
  • Experience with Foundry Silicon technologies, OSAT technologies and Substrate technologies
Job Responsibility
Job Responsibility
  • SIPI engineer for compute and AI SoCs and platforms – Implement strategies for end-to-end power delivery design and signal integrity design from Silicon to Package, and linking to Platform to System and Cloud
  • Deliver SIPI solutions that meet the HPC demands across the entire system
  • Drive future power and signal integrity solutions for chiplet architecture with advanced packaging and advanced silicon nodes
  • Design, model, and simulate SI and PI (i.e., incl. IP design, voltage regulator, motherboard, CPU package, silicon, and decoupling capacitor solution) for data center processors and corresponding platforms to ensure optimized performance
  • Performs DC, AC and transient simulation to provide noise, impedance profile of the whole power delivery path and link/electrical simulations to validate I/O performance from platform to silicon
  • Work closely with silicon and platform architects, motherboard and package designers, thermal architects and engineers, and power and performance engineers
  • Drives the execution of architecture solutions across product lines or multiple product groups across teams that account for design trends and future concepts by leveraging cross- functional expertise, industry best practices, and lessons learned from teams working across multiple product lines
  • Drives engineering system design decisions that require collaboration between internal and external stakeholders to account for platform-specific technology decisions and develop system models based on current and anticipated feature/design needs and trade-offs
  • Fulltime
Read More
Arrow Right

Senior Signal Integrity and Power Integrity Engineer

Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the...
Location
Location
United States , Raleigh
Salary
Salary:
119800.00 - 234700.00 USD / Year
https://www.microsoft.com/ Logo
Microsoft Corporation
Expiration Date
Until further notice
Flip Icon
Requirements
Requirements
  • Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 1+ year(s) technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 4+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 5+ years technical engineering experience OR equivalent experience
  • Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter
Job Responsibility
Job Responsibility
  • Implementing strategies for end-to-end signal integrity design from Silicon to Package, and linking to Platform to System and Cloud
  • Delivering SIPI solutions that meet the HPC demands across the entire system
  • Driving future power and signal integrity solutions for chiplet architecture with advanced packaging and advanced silicon nodes
  • Designing, modeling, and simulating SI and PI for data center processors and corresponding platforms to ensure optimized performance. Performs link/electrical simulations to validate I/O performance from platform to silicon
  • Working closely with silicon and platform architects, motherboard and package designers, thermal architects and engineers, and power and performance engineers
  • Driving the execution of architecture solutions across product lines or multiple product groups across teams that account for design trends and future concepts by leveraging cross- functional expertise, industry best practices, and lessons learned from teams working across multiple product lines
  • Driving engineering system design decisions that require collaboration between internal and external stakeholders to account for platform-specific technology decisions and develop system models based on current and anticipated feature/design needs and trade-offs
  • Fulltime
Read More
Arrow Right

PCB Layout Engineer

Designs, analyzes, develops, modifies and evaluates electrical/electronic parts,...
Location
Location
United States , Aguadilla
Salary
Salary:
Not provided
https://www.hpe.com/ Logo
Hewlett Packard Enterprise
Expiration Date
Until further notice
Flip Icon
Requirements
Requirements
  • Bachelor's or Master's degree in Electrical Engineering
  • Typically 2-4 years experience
  • Strong understanding of PCB materials, stack-up formulas, and design trade-offs (e.g., schedule, cost, risk, and DfX)
  • Ability to develop balanced layout solutions using systematic and data-driven approaches
  • Experience in high-speed signal layout, stack-up analysis, and routing optimization
  • Effective communication skills in English, both written and verbal
  • Using electrical design tools and software packages
  • Ability to apply analytical and problem solving skills
  • Designing electronic components, integrated circuitry, and algorithms
  • Using empirical analysis, modeling and testing methodologies to validate component, circuit, and hardware designs and thermal/emissions management
Job Responsibility
Job Responsibility
  • Lead layout floor planning and define component pinouts and fan-out strategies
  • Assess and optimize layer stack-up and routing for performance, cost, and manufacturability
  • Design and optimize high-speed bus layouts and PCB trace routing
  • Translate research and best practices into design guidelines and specifications
  • Collaborate with cross-functional teams to manage risk, prioritize design decisions, and ensure consistent design quality across platforms
  • Designs portions of engineering solutions for electrical and electronic parts, subsystems, integrated circuitry, and algorithms based on established engineering principles and in accordance with development technology practices and guidelines
  • Develops and implements parameters and test plans for existing designs, including validation of tolerances, form/fit/function, shock and vibration, electromagnetic interference, safety, reliability, thermal generation, and system power measurements
  • Collaborates and communicates with internal and outsourced development partners on electrical hardware design and development
  • Participates as a member of project team of other electrical hardware engineers and internal and outsourced development partners to develop reliable, cost effective and high quality solutions for low to moderately-complex products.
What we offer
What we offer
  • Health & Wellbeing
  • Personal & Professional Development
  • Unconditional Inclusion
  • Fulltime
Read More
Arrow Right

Senior Hardware Engineer - Signal Delivery

The Innovation Lab is an advanced R&D team that is part of the Semiconductor Tes...
Location
Location
United States , North Reading
Salary
Salary:
175300.00 - 280600.00 USD / Year
teradyne.com Logo
Teradyne
Expiration Date
Until further notice
Flip Icon
Requirements
Requirements
  • Bachelor’s or Master’s degree in Electrical Engineering or related field
  • Minimum 7 years of experience in signal integrity or high-speed hardware design
  • Proven experience with signal delivery in advanced semiconductor systems
  • Strong working knowledge interconnect standards
  • Experience working with microbump technology and its impact on signal integrity
  • Familiarity with fine pitch probing techniques and associated challenges
  • Proficiency in simulation tools such as Ansys HFSS, SIwave, ADS, or equivalent
  • Experience with PCB layout tools and design for signal integrity
  • Familiarity with lab equipment for signal validation (oscilloscopes, TDR, VNA)
  • Strong analytical and problem-solving skills
Job Responsibility
Job Responsibility
  • Lead the design and analysis of high-speed signal delivery systems supporting high speed industry data interfaces such as PCIe, UCIe, etc.
  • Develop simulation models and perform signal integrity analysis to ensure robust performance across various operating conditions
  • Collaborate with cross-functional teams including packaging, PCB layout, and silicon design to optimize signal paths and microbump connections
  • Build and validate prototypes to test signal delivery performance and compliance of system probe card interfaces including microbump and fine pitch probing specifications
  • Support product development from concept through production, ensuring signal integrity and reliability
  • Ensure compliance with industry standards and internal quality metrics
  • Drive PCB design efforts involving very large panels, high layer count sequential builds, and fine pitch sequential lamination
  • Lead development of ultra-fine pitch MLO (Multi-Layer Organic) substrates with embedded active and passive components
  • Coordinate and manage cross-site, global engineering teams to ensure alignment and execution across time zones
  • Provide clear, data-driven risk assessments and mitigation strategies to management and stakeholders
What we offer
What we offer
  • Teradyne offers a variety of robust health and well-being benefit programs, including medical, dental, vision, Flexible Spending Accounts, retirement savings plans, life and disability insurance, paid vacation & holidays, tuition assistance programs, and more
  • This job is eligible for discretionary bonus(es) based on financial performance
  • Fulltime
Read More
Arrow Right