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The Semiconductor Test Division has an immediate need for a Signal and Power Integrity Hardware Engineer to develop measurement instrument products. This hardware engineering position participates as a key person in the hardware design workflow necessary to physically realize complex rf, analog, digital and mixed-signal circuits at both the board and package substrate level. It serves as a primary interface function between PCB design, hardware engineering and manufacturing teams. This person will play an important role in all phases of hardware development from providing assessments on architectural feasibility, planning for signal and power integrity signoff validation, performing detailed interconnect optimization and constraint development, working with the PCB design team to insure that performance and manufacturability targets are met, and collaborating with hardware engineering to insure that our simulation models and methodologies can be validated against functional prototypes.
Job Responsibility:
Perform signal and power integrity analysis for complex PCB and package designs
Model and simulate high‑speed digital, analog, and RF circuits to ensure compliance with performance targets
Conduct timing, impedance, and electromagnetic field analysis using industry‑standard tools
Collaborate with hardware, PCB layout, and manufacturing teams to guide design decisions
Validate simulation results using lab equipment such as VNAs, TDRs, and high‑speed oscilloscopes
Perform S‑parameter, Z/Y‑parameter, and PDN analysis including target impedance and IR drop evaluation
Support design reviews with presentations, reports, and technical recommendations
Work with PCB fabricators and suppliers to ensure manufacturability and adherence to specifications
Recommend and develop innovative PCB design and process improvements
Requirements:
Bachelor’s Degree in Engineering (Manufacturing, Mechanical or Electronics preferred)
2+ years in hardware engineering role developing equivalent technologies
Strong understanding of EM theory, transmission line theory, impedance control, and EMI/EMC mitigation
Experience with modeling and simulating PCBs and packages for SI/PI and timing analysis
Familiarity with IBIS models and application of the IBIS 7.0 standard
Proficiency with tools such as Cadence Sigrity, Ansys HFSS/SI‑Wave/Maxwell/3D Layout, HyperLynx, or ADS
Knowledge of SPICE‑based tools including Cadence Spectre, PSpice, and HSpice
Experience with PCB design workflows, fabrication processes, and materials technologies
Proficiency with Cadence Allegro, Concept schematic entry, and SI/PI simulation environments
Experience using 2D/3D electromagnetic solvers (e.g., Sigrity, Clarity)
Strong analytical and problem‑solving skills with hands‑on lab experience
Nice to have:
High‑voltage PCB design experience (1kV or higher) is a plus
Programming skills in Tcl, Python, Perl, MATLAB, C/C++, C#, or Visual Basic are a plus