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Signal and Power Integrity Hardware Engineer

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Teradyne

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Location:
United States , North Reading

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Contract Type:
Not provided

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Salary:

86700.00 - 138700.00 USD / Year

Job Description:

The Semiconductor Test Division has an immediate need for a Signal and Power Integrity Hardware Engineer to develop measurement instrument products. This hardware engineering position participates as a key person in the hardware design workflow necessary to physically realize complex rf, analog, digital and mixed-signal circuits at both the board and package substrate level. It serves as a primary interface function between PCB design, hardware engineering and manufacturing teams. This person will play an important role in all phases of hardware development from providing assessments on architectural feasibility, planning for signal and power integrity signoff validation, performing detailed interconnect optimization and constraint development, working with the PCB design team to insure that performance and manufacturability targets are met, and collaborating with hardware engineering to insure that our simulation models and methodologies can be validated against functional prototypes.

Job Responsibility:

  • Perform signal and power integrity analysis for complex PCB and package designs
  • Model and simulate high‑speed digital, analog, and RF circuits to ensure compliance with performance targets
  • Conduct timing, impedance, and electromagnetic field analysis using industry‑standard tools
  • Collaborate with hardware, PCB layout, and manufacturing teams to guide design decisions
  • Validate simulation results using lab equipment such as VNAs, TDRs, and high‑speed oscilloscopes
  • Perform S‑parameter, Z/Y‑parameter, and PDN analysis including target impedance and IR drop evaluation
  • Support design reviews with presentations, reports, and technical recommendations
  • Work with PCB fabricators and suppliers to ensure manufacturability and adherence to specifications
  • Recommend and develop innovative PCB design and process improvements

Requirements:

  • Bachelor’s Degree in Engineering (Manufacturing, Mechanical or Electronics preferred)
  • 2+ years in hardware engineering role developing equivalent technologies
  • Strong understanding of EM theory, transmission line theory, impedance control, and EMI/EMC mitigation
  • Experience with modeling and simulating PCBs and packages for SI/PI and timing analysis
  • Familiarity with IBIS models and application of the IBIS 7.0 standard
  • Proficiency with tools such as Cadence Sigrity, Ansys HFSS/SI‑Wave/Maxwell/3D Layout, HyperLynx, or ADS
  • Knowledge of SPICE‑based tools including Cadence Spectre, PSpice, and HSpice
  • Experience with PCB design workflows, fabrication processes, and materials technologies
  • Proficiency with Cadence Allegro, Concept schematic entry, and SI/PI simulation environments
  • Experience using 2D/3D electromagnetic solvers (e.g., Sigrity, Clarity)
  • Strong analytical and problem‑solving skills with hands‑on lab experience

Nice to have:

  • High‑voltage PCB design experience (1kV or higher) is a plus
  • Programming skills in Tcl, Python, Perl, MATLAB, C/C++, C#, or Visual Basic are a plus
What we offer:
  • medical
  • dental
  • vision
  • Flexible Spending Accounts
  • retirement savings plans
  • life and disability insurance
  • paid vacation & holidays
  • tuition assistance programs

Additional Information:

Job Posted:
February 04, 2026

Employment Type:
Fulltime
Work Type:
On-site work
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