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Microsoft Quantum is a multidisciplinary team pioneering the development of scalable quantum computing technologies. We are seeking a Senior Thermal & Mechanical Engineer – Cryogenic Application-specific Integrated Circuit (ASIC) Integration to join our Quantum Systems team, focusing on the design, simulation, and testing of thermal solutions for cryogenic Complementary Metal-Oxide-Semiconductor (CMOS) integration and advanced packaging. This is a unique opportunity to shape the future of quantum computing in a dynamic, collaborative, and mission-driven environment.
Job Responsibility:
Drive thermal design and analysis for next-generation cryogenic CMOS systems
Model complex thermal loads and heat transfer mechanisms in the ultra-low temperature regime
Collaborate with cross-functional teams
Design and execute experiments to validate thermal models and characterize system performance at cryogenic temperatures
Specify and evaluate materials and interface solutions
Document findings, prepare technical reports, and communicate results
Embody our Culture and Values
Requirements:
Doctorate in Mechanical Engineering, Thermal Engineering, Applied Physics, Materials Science, Physics or related field AND 1+ years related technical engineering experience in industry
OR Master's Degree in Mechanical Engineering, Thermal Engineering, Applied Physics, Materials Science, Physics or related field AND 4+ years related technical engineering experience in industry
OR Bachelor's Degree in Mechanical Engineering, Thermal Engineering, Applied Physics, Materials Science, Physics or related field AND 6+ years related technical engineering experience in industry
OR equivalent experience
Ability to meet Microsoft, customer and/or government security screening requirements
Ability to leverage AI tools to drive innovation and efficiency
Ability to work in an “AI-first” environment using modern AI tools
Nice to have:
Doctorate in Mechanical Engineering, Thermal Engineering, Applied Physics, Materials Science, or Physics AND 3+ years related technical engineering experience OR Master's Degree in Mechanical Engineering, Thermal Engineering, Applied Physics, Materials Science, or Physics AND 6+ years related technical engineering experience OR Bachelor's Degree in Mechanical Engineering, Thermal Engineering, Applied Physics, Materials Science, or Physics AND 8+ years related technical engineering experience OR equivalent experience
4+ years of hands-on experience in solid-state thermal modeling, simulation, and testing
4+ years experience with thermal simulation software
4+ years experience with cryogenic ASIC integration and packaging
Proficient with quantum hardware platforms and requirements for solid-state quantum systems
4+ years experience with cryogenic hardware platforms
Ability to lead experimental design, instrumentation, and analysis for thermal measurements
Proficient communication and documentation skills
Committed to mentor junior engineers
Proficient understanding of conduction and solid-state heat transfer physics at cryogenic temperatures
Proven ability to lead experimental design, instrumentation, and analysis for thermal