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We are seeking a Senior / Principal Mechanical Engineer to provide technical leadership within the System Level Test (SLT) Thermal Engineering group. This role focuses on the design and delivery of advanced thermal solutions that enable testing of high-power semiconductor devices under challenging operating conditions. The SLT Thermal group develops end-to-end thermal systems, including device-level cooling hardware, liquid cooling architectures, and active thermal control methods. These solutions support testing of CPUs, GPUs, AI accelerators, automotive ICs, and advanced multi-die packages at very high-power levels and power densities, where traditional thermal approaches are not sufficient. This position is suited for an engineer who combines strong fundamentals, hands-on experimental work, and system-level thinking, and who is comfortable owning technical direction from concept through production. You will be expected to be the subject-matter expert and thermal management architect of entire system platforms.
Job Responsibility
Lead the definition, design, and validation of thermal systems that directly enable system-level semiconductor test
Architecting and developing device-level thermal solutions, including liquid-cooled cold plates, advanced thermal interface materials, and mechanically compliant interfaces
Designing and analyzing liquid cooling systems that support very high-power density devices
Leading thermal simulation efforts using CFD and analytical methods
Developing thermal solutions that support elevated-temperature operation and rapid thermal transients
Defining and executing experimental validation plans, including lab instrumentation, data acquisition, and detailed correlation of experimental results to simulation models
Collaborating with controls and software engineers to support active thermal control concepts
Supporting the transition of thermal designs from prototype through qualification and high-volume manufacturing
Mentoring junior engineers, reviewing technical work, and contributing to thermal design best practices and standards
Working directly with semiconductor manufacturers and system companies to understand device-level thermal requirements
Translating customer requirements into clear, actionable product and architecture definitions
Engaging with customers through onsite visits, technical reviews, and joint debug sessions
Acting as a technical point of contact and subject-matter expert for thermal topics during customer engagements
Managing customer expectations, timelines, and feature requests
Supporting definition and execution of customer-driven development programs
Staying current with scientific and industrial advancements in semiconductor thermal management
Monitoring emerging technologies and approaches
Evaluating new concepts and determining when they can be transitioned into manufacturable product solutions
Productizing emerging or immature technologies under aggressive schedules
Own and drive thermal architecture for complex SLT subsystems and systems
Lead design trade studies
Serve as a technical resource and mentor
Perform and guide thermal modeling using CFD and analytical methods
Design and optimize liquid-cooled cold plates, thermal interfaces, and supporting structures
Evaluate thermal performance of advanced device packages with non-uniform and transient heat loads
Plan and execute thermal experiments to validate designs
Use experimental data to refine models
Support transition from prototype to manufacturing
Work with suppliers and manufacturing partners on advanced thermal hardware
Investigate and resolve thermal issues encountered during qualification or production
Requirements
B.S. in Mechanical Engineering (M.S. or Ph.D. a plus)
Typically, 8+ years of experience in thermal, heat-transfer, or mechanical systems engineering
Ability to demonstrate academic knowledge of heat transfer principles
Strong foundation in heat transfer, fluid mechanics, and thermal system design
Experience with liquid cooling systems and high-power electronics
Proficiency with thermal simulation tools (CFD / FEA)
Experience working with lab data, test instrumentation, and model correlation
CAD experience (SolidWorks or equivalent)
Thermal simulation tools such as ANSYS Fluent, Icepak, COMSOL, OpenFOAM or similar
Data analysis using tools such as MATLAB SIMULINK, Python, or LabVIEW