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Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft's expanding Cloud Infrastructure and responsible for powering Microsoft's "Intelligent Cloud" mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for passionate engineers to help achieve that mission. The Compute Silicon & Manufacturing Engineering (CSME) organization within SCHIE is responsible for design, development, manufacturing and packaging of Microsoft's state-of-the-art computer chips, notably the Azure Cobalt. Our solutions provide sustainable strategic advantage to Microsoft and enable our customers to achieve more. As Microsoft's cloud business continues to grow the ability to deploy new offerings and hardware infrastructure on time, in high volume with high quality and lowest cost is of paramount importance. To achieve this goal, the Silicon Manufacturing and Product Engineering team is instrumental in defining and delivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware. We are looking for seasoned engineers with a dedicated passion for customer focused solutions, insight and industry knowledge to envision and implement future technical solutions that will manage and optimize the Cloud infrastructure. We are looking for a Senior Test Engineer to join the team.
Job Responsibility
Responsible for product and engineering activities supporting new product development and manufacturing, with primary focus on scan (structural) test
Contribute to silicon bring-up, validation, and manufacturing readiness while working closely with cross-functional partners
Support semiconductor IC development across fabrication, manufacturing test, and packaging phases
Contribute to ATE test program development, including scan pattern integration, test method implementation, bring-up, silicon characterization, debug, and yield analysis for logic defects
Execute defined test plans and methodologies while identifying issues and escalating risks with clear technical data
Apply working knowledge of Design-for-Test (DFT), including scan architecture, ATPG, fault models, silicon fabrication processes, product qualification and reliability, and basic transistor theory
Collaborate with design, DFT, product, and manufacturing teams to support scan test readiness, coverage closure, and issue resolution
Gain exposure to product domains such as high-performance computing, AI, GPUs, and telecom, as applicable to assigned projects
Apply industry-standard DFT features, including scan (SAF/TDF), JTAG, boundary scan, and at-speed testing
Support scan test content generation, including ATPG pattern validation, pattern bring-up, and post-silicon debug activities
Understand scan fault models (e.g., stuck-at and transition faults), coverage targets, and defect screening methodologies
Utilize scan diagnosis tools to perform failure analysis, identify defect locations, and support yield improvement activities
Work with DFT teams to support simulation, emulation, and pattern verification for scan test validation
Requirements
Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 1+ year(s) technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 4+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 5+ years technical engineering experience OR equivalent experience
Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter
This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations or Export Administration Regulations, the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their US. residency or other protected status (e.g., under 8 U.S.C. 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate's citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable
Nice to have
5+ years of experience in integrated circuit development, including pre-silicon, first silicon bring-up, or new product introduction
5+ years of experience in product and test engineering, with hands-on exposure to ATE test program development, bring-up, and debug for scan
Experience working on complex SoCs or chips, including exposure to high-performance, AI, or advanced-node designs
Clear written and verbal communication skills with the ability to present technical data effectively
Experience collaborating with cross-functional teams in a structured development environment
Working knowledge of probability, statistics, and basic DOE concepts
Familiarity with DFT and DFM techniques, with emphasis on scan/structural test methodologies
Experience with scan/ATPG methodologies, including pattern generation, validation, and test flows
Understanding silicon bring-up, debug, and characterization on ATE platforms (e.g., Advantest 93K) for scan test content
Exposure to mixed-signal IP test development and its interaction with structural test is a plus
Basic device physics background
Demonstrated adaptability, curiosity, and constructive problem-solving approach
Strong Growth Mindset with a desire to learn and expand technical depth
Fundamentals of computer architecture
Good unit and integration testing skills
Proficiency with Linux-based environments
Experience debugging and optimizing test programs, ATPG patterns, or validation flows
Customer-focused mindset with attention to quality, coverage, and execution
Demonstrated ability to deliver results on assigned tasks with guidance
Sound technical judgment in scoping and resolving well-defined problems