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Lead technology development and supply chain bring up of advanced substrate technologies to support AMD product roadmap. The candidate should have a proven track record in developing advanced packaging technologies at a substrate supplier, OSAT or Fabless/IDM, as well as identifying and enabling new substrate and PCB vendors. He/she should have a hands-on approach to new process development with a deep knowledge of packaging and board design rules, process flows, materials, and equipment. They should have excellent oral and written communication skills to communicate ideas and technology target requirements with suppliers, internal partners, product architects and AMD management.
Job Responsibility:
Define advanced substrate and board technology roadmap across pitch scaling, power delivery, signal integrity and cost vectors
Partner with AMD architects, designers, and product owners to define high yielding, cost effective substrate solutions which meet product requirements
Select development partners to bring into AMD supply chain to enable industry leading substrate and PCB technology building blocks
Partner with product, quality and manufacturing engineering teams to meet various milestones for manufacturability, yield and reliability from concept through NPI
Qualify package substrates of new products meeting cost and yield targets
Requirements:
Five plus years of experience leading cross functional teams to achieve technology certification, yield/cost reduction initiatives, equipment set up
Proven record of communicating complex technical challenges to executive level/management
Prior experience working with international teams across various time zones
BS/MS/PhD in solid state physics, Chemistry, Material science, Chemical engineering or equivalent