CrawlJobs Logo

Senior Physical Design Engineer

United States, Raleigh 119800.00 - 234700.00 USD / Year · Job Posted January 30, 2026
Apply Position
Job Link Share

Job Description

Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for passionate engineers to help achieve that mission. The Compute Silicon & Manufacturing Engineering (CSME) organization within SCHIE is responsible for design, development, manufacturing and packaging of Microsoft's state-of-the-art computer chips, notably the Azure Cobalt. Our solutions provide sustainable strategic advantage to Microsoft and enable our customers to achieve more. As Microsoft's cloud business continues to grow the ability to deploy new offerings and hardware infrastructure on time, in high volume with high quality and lowest cost is of paramount importance. To achieve this goal, Microsoft’s Compute Silicon & Manufacturing Engineering team is instrumental in defining and delivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware. We are looking for seasoned engineers with a dedicated passion for customer focused solutions, insight and industry knowledge to envision and implement future technical solutions that will manage and optimize the Cloud infrastructure. We are looking for a Senior Physical Design Engineer to join the team.

Job Responsibility

  • Responsible for Hierarchical Design Planning and partitioning strategies
  • Responsible for RTL to GDS implementation in Physical Design domain
  • Coordinate with CAD, RTL/Design teams/DFT, Architecture team, Power & Performance team, Technology team & other internal/external partners as essential
  • Help influence design tools, flows, and methodologies in construction, signoff, and optimization through a data-driven approach
  • Execute floor-planning and design planning activities to optimize timing-critical and large sub-chips for power, performance, and area (PPA)
  • Drive end-to-end execution from synthesis through place-and-route for large designs, ensuring completion of all signoff stages including timing, physical verification, EMIR, formal equivalence, and low-power verification
  • Develop guidelines, checklists, and best practices for top-level physical design
  • Make sound technical trade-offs between power, area, and timing to achieve optimal design outcomes
  • Foster collaboration across teams to deliver the best possible solutions, aligned with a One Microsoft mindset
  • Demonstrate technical expertise across various domains of Physical Design & Timing Signoff
  • Clear communications on project status & planning
  • Demonstrate Microsoft core values: Customer Focus, Adaptability, Collaboration, Growth Mindset, Drive for Results, Influence for Impact, Judgement, and Diversity & Inclusion

Requirements

  • Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 1+ year(s) technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 4+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 5+ years technical engineering experience OR equivalent experience
  • Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include, but are not limited to, the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud background check upon hire/transfer and every two years thereafter

Nice to have

  • BS/MS in Electrical or Computer Engineering or any related degree
  • Preferred 8+ years of experience in semiconductor design
  • Great communication, collaboration and teamwork skills and ability to contribute to diverse and inclusive teams
  • Proven track record in Physical Design domain implementing designs through synthesis, floorplanning, place and route, extraction, timing, and physical verification
  • Experience in hierarchical design work, Design Planning and integration with multiple production tape-outs using advanced foundry process nodes
  • Demonstrate technical expertise in all aspects of Physical Design, from synthesis to place and route of partitions through all signoff including timing signoff, physical verification, EMIR signoff, Formal Equivalence, and Low Power Verification
  • Own complete PD execution of Critical blocks/Partitions/Sub-systems/Sub-chips instantiating/integrating multiple other Physical partitions. Be fully hands-on in your individual ownerships as individual contributor and collaborate cross-team as required
  • Proficient in integration activities and design planning (DP) methodology with hands-on experience
  • Good understanding of timing constraints (functional & DFT), static timing analysis (STA), and timing-power optimization
  • Thorough understanding of SOC or subsystem design trade-offs across power, performance, and area (PPA)
  • Hands-on experience with clock tree synthesis (CTS) and global clock distribution in complex multi-voltage, multi-clock, multi-domain, and low-power designs
  • Partner closely with PD flow/CAD team and PD methodology team to flag & fix PD TFM issues upfront and ensure those are fixed in the next PD TFM release from CAD or are updated in the design project layer (as appropriate)
  • Skilled in industry-standard EDA tools (Synopsys or Cadence)
  • Mentor junior engineers on technical aspects
  • Advanced proficiency in Engineering Change Order (ECO) implementation for power and timing convergence, with solid knowledge of functional and DFT ECO closure methodologies
  • Demonstrated ownership of deliverables and strong cross-functional teamwork
  • Proven track record in mentoring, influencing teams, and driving alignment through clear and effective communication
  • Strong analytical and problem-solving skills, complemented by advanced scripting capabilities in Perl, TCL, and Python

Looking for more opportunities?

Search for other job offers that match your skills and interests.

Similar Jobs for

Senior Physical Design Engineer

8 matching positions

Senior Physical Design Engineer

Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the...
Location
Location
Malaysia , Gelugor
Salary
Salary:
Not provided
https://www.microsoft.com/ Logo
Microsoft Corporation
Expiration Date
Until further notice
Flip Icon
Requirements
Requirements
  • BS/MS in Electrical or Computer Engineering
  • 8+ years of experience
  • Experience in EDA tools such as Primetime, StarRC, Design Compiler, ICC, Innovus etc.
  • Strong understanding of constraints generation, STA, timing optimization, and timing closure.
  • Great communication, collaboration and teamwork skills and ability to contribute to diverse and inclusive teams.
  • Proven track record of implementing designs through synthesis, floorplanning, place and route, extraction, timing, and physical verification.
Job Responsibility
Job Responsibility
  • Own and drive floorplanning and design planning for optimizing Mixed-Signal IPs with Analog and Digital components
  • Own and drive execution from synthesis to place and route of IPs, all signoff including timing signoff, physical verification, EMIR signoff , Formal Equivalence, and Low Power Verification.
  • Define Analog / Digital interfaces to facilitate design convergence and optimize power delivery for optimal performance (topmetal & bump planning)
  • Have close collaboration with RTL team to help drive and resolve design issues related to toplevel and block closure.
  • Influence tools, flows, and overall design methodology in design construction, signoff, and optimization with a data driven approach.
  • Make good independent technical trade-offs between power, area, and timing.
  • Provide technical leadership and collaborate across teams to come up with the best solution possible with a One Microsoft mindset.
  • Fulltime
Read More
Arrow Right

Senior Physical Design Engineer

Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the...
Location
Location
United States , Raleigh
Salary
Salary:
119800.00 - 234700.00 USD / Year
https://www.microsoft.com/ Logo
Microsoft Corporation
Expiration Date
Until further notice
Flip Icon
Requirements
Requirements
  • Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 1+ year(s) technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 4+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 5+ years technical engineering experience OR equivalent experience.
  • Ability to meet Microsoft, customer and/or government security screening requirements are required for this role.
  • This role will require access to information that is controlled for export under export control regulations.
  • As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their US. residency or other protected status.
  • To meet this legal requirement, and as a condition of employment, the successful candidate’s citizenship will be verified with a valid passport.
Job Responsibility
Job Responsibility
  • Experience and knowledge on Synthesis, RTL / DFT feedback , Timing Constraints.
  • Responsible for RTL to GDS implementation in Physical Design domain for production flagship projects.
  • Coordinate with CAD, RTL/Design teams/DFT, Architecture team, Power & Performance team, Technology team & other internal/external partners.
  • Influence design tools, flows, and methodologies in construction, signoff, and optimization through a data-driven approach.
  • Demonstrate technical expertise across various domains of Physical Design & Timing Signoff.
  • Lead and manage floor-planning and design planning activities to optimize timing-critical and large sub-chips for power, performance, and area (PPA).
  • Drive end-to-end execution from synthesis through place-and-route for block execution, ensuring completion of all signoff stages including timing, physical verification, EMIR, formal equivalence, and low-power verification.
  • Make sound technical trade-offs between power, area, and timing to achieve optimal design outcomes.
  • Foster collaboration across teams to deliver solutions, aligned with a One Microsoft mindset.
  • Clear communications on project status & planning.
  • Fulltime
Read More
Arrow Right

Senior Physical Design Engineer

Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the...
Location
Location
India , Bangalore
Salary
Salary:
Not provided
https://www.microsoft.com/ Logo
Microsoft Corporation
Expiration Date
Until further notice
Flip Icon
Requirements
Requirements
  • Bachelor's or master’s in electrical or computer engineering or related field with 8+ years of experience
  • Experience in physical design implementation, signoff at block / sub system / sub-chip / SoC level
  • Experience in tapeouts of complex ASICs in leading edge technology
  • Ability to meet Microsoft, customer and/or government security screening requirements
  • This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter
  • This role will require access to information that is controlled for export under export control regulations
  • As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their US. residency or other protected status
  • To meet this legal requirement, and as a condition of employment, the successful candidate’s citizenship will be verified with a valid passport
Job Responsibility
Job Responsibility
  • Physical Design tasks at block, subsystem, sub-chip, and/or full-chip level
  • Tasks will include Floorplanning, Synthesis, Placement, CTS and custom clocking, Routing, Static Timing, Physical Verification, Formal Equivalency, Power Efficiency, IR-Drop, and EM
  • May also be involved in Physical Design flow development/automation and evaluation of and recommendations for technology, IP, and vendor selection
  • Work with limited direction, have keen attention to detail, and be able to provide crisp status of progress, issues, and risks on the program to the management team
  • Fulltime
Read More
Arrow Right

Senior Physical Design Engineer

As a Senior Physical Design Engineer, you will be responsible for the physical i...
Location
Location
United States , Batavia, Illinois
Salary
Salary:
Not provided
nhanced-semi.com Logo
NHanced Semiconductors
Expiration Date
Until further notice
Flip Icon
Requirements
Requirements
  • US Citizenship
  • 5+ years of experience in physical design, specifically in ASIC, SoC, or advanced packaging (2.5D, 3DIC) technologies
  • Hands-on experience with Git-based version control systems for managing design revisions
  • Experience with timing closure and signal integrity
  • Proficiency in Cadence tools for physical design, timing analysis, and signoff
  • Strong understanding of RTL-to-GDSII flows, including floorplanning, power planning, place-and-route, and timing closure
  • Working knowledge of parasitic extraction (PEX), power integrity (PI), and thermal analysis in multi-die environments
  • Ability to work independently with minimal supervision and drive tasks to completion
  • Excellent verbal and written communication skills for collaboration across engineering teams
  • Strong debugging skills and ability to analyze tool reports, logs, and simulation results
Job Responsibility
Job Responsibility
  • Drive full-chip physical implementation of 2.5D interposer and ASIC designs, including floorplanning, placement, clock tree synthesis (CTS), routing, and optimization
  • Ensure design compliance with timing, power, and area (PPA) requirements, as well as DFM, DRC, and LVS constraints
  • Utilize Cadence tools (Innovus, Virtuoso, Tempus, Voltus, Pegasus, etc.) for physical design, verification, and signoff
  • Develop and execute timing closure strategies, working with STA engineers to meet performance goals
  • Optimize power distribution networks (PDN) and electromigration (EM) reliability in multi-die packaging environments
  • Work with package and system engineers to optimize die-to-die interconnect, bump placement, and TSV integration
  • Collaborate with RTL designers, DFT engineers, and backend teams to ensure seamless integration
  • Implement ECOs (Engineering Change Orders) and efficiently iterate design revisions
  • Utilize Git-based version control workflows for design database management and collaborative development
  • Identify and resolve congestion, signal integrity (SI), and crosstalk issues in complex designs
Read More
Arrow Right

Senior Physical Design Engineer

We are looking for an adaptive, self-motivative physical design engineer to join...
Location
Location
Malaysia , Penang
Salary
Salary:
Not provided
amd.com Logo
AMD
Expiration Date
Until further notice
Flip Icon
Requirements
Requirements
  • MSEE with 2+ years or Bachelor with 5+ years of industrial experience in ASIC design
  • Familiar with Back-End (physical design) EDA tools
  • Hands on experience in large scale ASIC chip physical design
  • Knowledgeable in all aspects of deep submicron ASIC design flow
  • Successfully gone through several complete product development cycles
  • Demonstrate strong problem-solving and work well with cross-functional teams
  • Good listening, writing and speaking English
  • Good communication skills, strong interpersonal skills and flexibility
  • Dedicated, hardworking and good team player
  • Familiar with Unix/Linux environment and good at scripts
Job Responsibility
Job Responsibility
  • Drive and improve AMD's abilities to deliver the MI/Navi series of GPU products to market
Read More
Arrow Right

Asic / Physical Design Engineer (Int, Senior and Principal)

Location
Location
Canada , Ottawa
Salary
Salary:
Not provided
myticas.com Logo
Myticas Consulting
Expiration Date
Until further notice
Flip Icon
Requirements
Requirements
  • 8+ years in ASIC Physical Design / Backend Implementation (PnR)
  • End-to-end experience from netlist to GDSII (full physical design flow)
  • Strong hands-on with Place & Route (floorplan, CTS, routing, optimization)
  • Proven timing closure expertise (setup/hold, ECO implementation)
  • Deep experience with Synopsys and/or Cadence tool suites
  • Advanced node exposure (FinFET, sub-10nm / 7nm / 5nm preferred)
  • Strong Static Timing Analysis (STA) and timing report analysis
  • Experience with clock tree synthesis (CTS) and clock optimization
  • Solid understanding of DRC/LVS and physical verification flows
  • IR drop / power integrity analysis and optimization experience
  • Fulltime
Read More
Arrow Right

Senior Staff Physical Design Engineer

We are looking for an adaptive, self-motivative physical design engineer to join...
Location
Location
Malaysia , Penang
Salary
Salary:
Not provided
amd.com Logo
AMD
Expiration Date
Until further notice
Flip Icon
Requirements
Requirements
  • Strong experience and specialization in deep‑submicron ASIC physical design, including all phases from RTL-to-GDSII and signoff
  • Proven record of Physical Design signoff flow
  • Hands-on experience with industry-standard EDA tools (e.g., Cadence Innovus, Tempus, PrimeTime, Fusion Compiler, Calibre)
  • Excellent scripting skills in TCL, Shell, Python, or Perl to enhance PD flows and automation
  • Proven ability to work with cross-functional teams across multiple sites/time zones
  • Strong analytical, problem-solving, and communication skills
  • Familiarity with CPU and or GPU architecture
  • Proficiency in data analysis and interpretation
Job Responsibility
Job Responsibility
  • Static Timing Analysis (STA) across MMMC scenarios: Driving timing closure at block and full‑chip levels, resolving violations through ECOs, constraint refinements, and reviewing SoC and block‑level signoff readiness. Lead timing signoff (setup, hold, OCV, AOCV/POCV, SI, CDC interfaces) across all modes and corners
  • Logic Equivalence Check (LEC) for all blocks and full‑chip: Executing equivalence verification between RTL, synthesis, and P&R databases
  • Low‑power structural checks (UPF/CLP): Ensuring correctness of power‑intent implementation, power‑domain crossings, isolation/retention, and coverage of low‑power signoff flows
  • Physical Integrity Signoff: Overseeing DRC/LVS structural verifications, and ensuring designs adhere to foundry signoff rules. Perform and review IR drop, EM, and power integrity signoff
  • Clocking and top‑level mesh implementation and signoff
  • Own and drive block-level and/or full-chip physical implementation and signoff to tape-out
  • Analyze complex cross-block and top-level signoff issues and define closure strategy
  • Define and enforce signoff criteria, methodologies, and best practices
  • Partner with PD implementation teams to guide ECO strategy for timing, power, and physical fixes
  • Identify risk areas early and proactively drive mitigation plans
Read More
Arrow Right

Senior SoC/ASIC Physical Design Engineer

About the Job: We are seeking a highly skilled Senior SoC/ASIC Physical Design E...
Location
Location
United States , Irvine
Salary
Salary:
Not provided
xcelerium.com Logo
Xcelerium
Expiration Date
Until further notice
Flip Icon
Requirements
Requirements
  • Bachelor’s degree in Electrical Engineering, Computer Engineering, or Computer Science (Master’s preferred)
  • 10+ years of experience in ASIC/SoC physical design and flow development
  • Expertise in RTL-to-GDSII physical design and signoff flows
  • Strong experience with Synopsys EDA tools, understanding tool capabilities and underlying algorithms
  • Proficient in physical design methodologies: synthesis, place & route, STA, formal verification, CDC, and power analysis
  • Knowledge of FinFET and deep sub-micron CMOS technologies, including power dissipation, leakage, and dynamic behavior
  • Familiarity with DFT, Scan, MBIST, and LBIST methodologies and their impact on physical design
  • Proficient in scripting languages (Python, Tcl, Perl, bash/csh) and automation using Makefiles
  • Skilled in extraction and analysis of design parameters, QOR metrics, and implementing voltage scaling (SVS, DVFS) and SRAM split rail architectures
  • Proven ability to work collaboratively in dynamic environments, lead design closure activities, and drive execution with a proactive, solution-oriented mindset
Job Responsibility
Job Responsibility
  • Develop and Implement PD Flow: Establish a modern physical design (PD) flow utilizing the latest EDA tool fusion and machine learning (ML) techniques to maximize PPA efficiency, optimize resource allocation, and achieve industry-leading time-to-closure and tapeout
  • End-to-End Physical Design Execution: Perform partition synthesis and physical implementation, including synthesis, floorplanning, power/ground grid generation, place & route, timing, noise, physical verification, electromigration, voltage drop, and signoff checks
  • Methodology and Automation: Create and refine physical design methodologies and automation scripts to streamline implementation and signoff processes
  • Cross-Functional Collaboration: Work closely with RTL, DFT, and ASIC design teams to define architectural feasibility, establish timing, power, and area targets, and explore design trade-offs
  • Drive Design Closure: Utilize an objective, metrics-driven approach to resolve design, timing, and flow issues and ensure predictability in achieving project milestones
  • Signoff Ownership: Lead signoff closure activities, including static timing analysis (STA), noise analysis, logic equivalency, physical verification, and power integrity (EM/IR)
What we offer
What we offer
  • We provide competitive compensation package
Read More
Arrow Right