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Develops and implements production/processing methods and controls to meet quality standards in the most efficient manner for Photonic and Electronic Advanced Packaging. Monitors the assembly process; troubleshooting problem processes and assisting in resolving quality issues. Is the technical expert on various projects/productions jobs and process as required.
Job Responsibility:
Develop new assembly processes including material selection, methods and continuous improvement
Operate production and test equipment in a prototype/NPI line
Work with colleague engineers, technicians and operators for NPI and prototype production
Act as equipment prime for specific machines, driving procurement, maintenance, spares and service as required
May lead the startup of new/existing projects/production jobs, optimizing cost, efficiency and quality
May lead the process control and maintain appropriate documentation
Monitor the assembly/molding process running in production
troubleshoot problems associated with processes, and assist in resolving quality issues
Establish detailed processes for new product lines
document product development and changes
evaluate new product performance
and monitor new tool design
Debug significant complex problems in new systems, tooling and automation
Design major experiments to enhance processes as well as improve yields and utilization through reduced cycle and efficient set-up
Lead and implement major maintenance changes in process improvements
propose or specify repair alteration of automation while ensuring adequate documentation is maintained
Provide functional and technical mentoring to process technicians and other process engineers
Maintain a clean and safe work environment
supporting all company safety programs and initiatives
Support all company safety and quality programs and initiatives
Apply and support Lean Manufacturing principles
May perform other duties and responsibilities as assigned
Requirements:
At least five years of compatible experience with advanced packaging, particularly flip-chip, die bond, wire bond and alignment
Master level or above degree in related discipline