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At Microsoft Research, we are shaping the future of AI infrastructure by pursuing high-risk and high-reward programs that will define the next generation of AI platforms. Our work spans the full stack, models, systems, software, and hardware, and we partner with product teams across Microsoft to turn research breakthroughs into impact at scale. Through close collaboration with industry partners, the team bridges research and production, translating hardware innovation into working prototypes and manufacturable solutions for next-generation AI infrastructure. You will join a multidisciplinary team working at the intersection of optics, electronics, photonics, packaging, networking, and AI system design. We are looking for an Optoelectronics Engineer to join our team and drive the co-design of optical and electronic systems at the intersection of photonics, integrated circuit design, and signal processing. In this role, you will help develop scalable, power-efficient connectivity solutions for next-generation data centre and AI systems, with a focus on co-packaged optics and advanced optical I/O technologies. You will have the unique opportunity to work hands-on with cutting-edge technologies while collaborating with R&D teams, Azure product teams, and Tier-1 partners to translate research innovations into deployable systems.
Job Responsibility
Design and develop high-speed optoelectronic systems, including optical transceivers and connectivity chip architectures
Perform system-level modelling and co-simulation of electronic, photonic, and packaging effects
Co-design electrical and optical interfaces, ensuring signal integrity, bandwidth efficiency, and power optimization
Develop and implement high-speed interface architectures, spanning host-side SerDes and parallel low-speed optical links, including analog equalization, clocking strategies, and link-level optimization
Design and simulate analog and mixed-signal CMOS circuits (e.g., drivers, TIAs, PLLs)
Contribute to ASIC and IC design flows, including architecture definition, modelling, and verification
Collaborate with internal teams and external partners to support tape-outs, bring-up, and validation of silicon and photonic devices
Analyze experimental data, align it with simulation outcomes, and drive iterative design improvements to meet performance targets
Requirements
PhD in Electrical Engineering, Physics, Photonics, Optical Engineering, or a related field
Strong background in signal processing for communication systems, analog/mixed-signal circuit design, Integrated circuit (ASIC/CMOS) design
Proven industry experience in the design and delivery of optoelectronic systems and integrated circuits
Experience with optical transceivers, connectivity systems, or advanced optical I/O architectures
Hands-on experience with lab measurements and characterisation (e.g., RF measurements, eye diagrams, BER testing)
Strong experience in end-to-end link modelling and simulation, including circuit-level (SPICE) and system-level (Python-based) analysis
Ability to operate effectively in a multi-disciplinary environment
Excellent communication skills in English, both written and spoken, including the skill to clearly communicate technical results and justify assumptions to diverse technical audiences
Nice to have
Experience with co-packaged optics, optical interconnects, or data centre networking technologies
Demonstrated track record of taking designs from concept through tape-out, bring-up, and validation
Solid foundation in optical communication, including fibre transmission, channel impairments, and system-level trade-offs such as power, reach, bandwidth, latency, and reliability
Experience collaborating with external manufacturing partners and Tier-1 suppliers across design, fabrication, and system integration phases