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At Microsoft Research, we are shaping the future of AI infrastructure by pursuing high-risk and high-reward programs that will define the next generation of AI platforms. Our work spans the full stack, models, systems, software, and hardware, and we partner with product teams across Microsoft to turn research breakthroughs into impact at scale. Through close collaboration with industry partners, the team bridges research and production, translating hardware innovation into working prototypes and manufacturable solutions for next-generation AI infrastructure. You will join a multidisciplinary team working at the intersection of optics, electronics, photonics, packaging, networking, and AI system design. We are seeking an Optical Packaging Engineer with deep expertise in co-packaged optics and advanced packaging technologies. The successful candidate will play a critical role in bridging photonic devices, electronic ICs, and system-level integration through scalable, manufacturable packaging solutions. You will work closely with both Microsoft R&D teams and Azure engineering teams to bring innovations from prototype to production. This role offers a unique opportunity to work hands-on with cutting-edge technologies while collaborating with world-class researchers, internal product teams, and Tier-1 partners to translate research into deployable systems.
Job Responsibility
CPO Architecture & Packaging Co-Design
Advanced Packaging Development
Optical Assembly & Alignment Strategy
Cross-Disciplinary Co-Design
Partner Engagement & Technology Transfer
Prototyping, Validation & Iteration
Requirements
Master’s or PhD’s degree in Electrical Engineering, Photonics, Materials Science, or a related field
Proven industry experience in wafer/panel level and advanced packaging with a strong focus on optical packaging, Co-packaged optics (CPO) or closely related technologies
Hands-on experience with: Optical module or CPO packaging design, Fiber attach / optical coupling techniques, High-speed interconnect packaging and signal integrity considerations
Strong understanding of system-level trade-offs (electrical, optical, thermal, mechanical)
Ability to operate effectively in a multi-disciplinary environment
Excellent communication skills in English, both written and spoken, including the skill to clearly communicate technical results and justify assumptions to diverse technical audiences
Nice to have
Experience in advanced semiconductor packaging (e.g., FCBGA, 2.5D/3D integration)
Familiarity with hyperscale data center interconnect requirements
Experience working with external manufacturing partners or Tier-1 suppliers
Track record of delivering packaging solutions from concept to prototype or production