Senior Microelectronics Process Engineer Job at Sanmina (Kanata, ON)

Job Description

We are seeking an industry expert to lead the process architecture and development for our next-generation optical and microelectronic process solutions. In this pivotal role, you will act as the technical anchor for our product solutions team. You will not simply run processes; you will define the assembly strategy from the ground up. Bridging the gap between R&D and high-volume manufacturing, you will own the end-to-end process lifecycle—from initial concept and recipe development to equipment selection and final release-to-manufacturing.

Job Responsibility

Define the Strategy: Conceptualize and develop comprehensive assembly strategies for complex optoelectronic modules
Advanced Packaging Execution: Lead the hands-on development of critical process recipes, including Flip Chip, Underfill, Die Attach (epoxy & eutectic AuSn), and Wire Bonding (ball/wedge)
Equipment Leadership: Research, specify, and procure capital equipment. Oversee acceptance testing (SAT/FAT)
Design Partnership: Act as the primary feedback loop to the internal design team and external customers. Provide expert DFx (Design for Assembly/Manufacturing) guidance
Tooling & Fixturing: Conceptualize and drive the design of custom tooling and fixtures required for novel assembly techniques
Customer Interface: Serve as the primary technical liaison for customers during the development phase
Rigorous Methodology: Implement robust process controls using PFMEA and Control Plans
Root Cause Analysis: Lead complex troubleshooting efforts using methodical approaches (8D, etc.)
Documentation: Author and approve high-level process assembly documentation and process qualification reports
Technical Mentorship: Act as a subject matter expert and mentor to junior and intermediate engineers
Project Management: Manage engineering timelines and milestones to ensure customer NPI builds are delivered on schedule

Requirements

Master’s Degree in Engineering (Materials, Electrical, Mechanical, or Physics)
Minimum 8+ years of direct, hands-on experience in microelectronics packaging and process engineering
Deep expertise in Flip Chip and Wire Bonding (Chip & Wire) processes
Strong understanding of material interactions, including underfills, epoxies, and gold-tin (AuSn) soldering/reflow processes
Proficiency in programming automated assembly equipment (pick-and-place, dispensers, wire bonders)
Demonstrated experience driving Engineering Change Orders (ECOs) and process qualifications
Strong background in statistical process control (SPC) and data analysis

Nice to have

Experience specifically within the Photonics/Microelectronics sector
Proficiency with CAD tools (AutoCad, SolidWorks) for tooling design
Knowledge of Lean Manufacturing and Six Sigma principles

What we offer

Impact: Work on cutting-edge technologies that are shaping the future of connectivity
Growth: A visible role with the opportunity to shape the engineering culture and technical roadmap of the organization
Accommodations are available on request for candidates taking part in all aspects of the selection process

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Senior Microelectronics Process Engineer

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