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Senior IC Packaging Engineer

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Microsoft Corporation

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Location:
United States , Hillsboro

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Category:
IT - Software Development

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Contract Type:
Not provided

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Salary:

119800.00 - 234700.00 USD / Year
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Job Description:

The Senior IC Package Engineer will be responsible for providing expertise, insight, and support to the Silicon device development team through the entire life cycle of the product. In this role, you will be responsible for supporting the design and implementation of new custom Silicon devices, evaluation and recommendation of new packaging technology, Substrate design support, device/package qualification, supplier assessment, manufacturing bring up, and driving quality/reliability in development and production.

Job Responsibility:

  • Work with product architects to determine the optimal packaging solution
  • Drive package technology solutions for chiplet architecture with advanced packaging.
  • Drive supplier assessments and manage suppliers through definition, development, qualification and production.
  • Develop and deliver FMEA (Failure Mode and Effects Analysis) for various technology options.
  • Define, design and develop test vehicles to validate Silicon, Package, System performance.
  • Support substrate design working with suppliers and internal teams
  • Assess and characterize the reliability of Integrated Circuits (IC) packages.
  • Design and develop package and assembly drawings to support the manufacturing.
  • Work closely with silicon and platform architects, motherboard and package designers, thermal architects and engineers, and power and performance engineers.
  • Drives the execution of architecture solutions across product lines or multiple product groups and across teams that account for design trends and future concepts by leveraging cross- functional expertise, industry best practices, and lessons learned from teams working across multiple product lines.
  • Drives engineering system design decisions that require collaboration between internal and external stakeholders to account for platform-specific technology decisions and develop system models based on current and anticipated feature/design needs and trade-offs.

Requirements:

  • Doctorate in Electrical Engineering, Computer Engineering, Computer Science, Physics, Chemistry or related field AND 1+ year(s) technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, Chemistry or related field AND 4+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, Chemistry or related field AND 5+ years technical engineering experience OR equivalent experience.
  • Ability to meet Microsoft, customer and/or government security screening requirements are required for this role.
  • This role will require access to information that is controlled for export under export control regulations.
  • As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their US. residency or other protected status.

Nice to have:

  • Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR equivalent experience.
  • Master’s Degree with 10 years experience in semiconductor package product development
  • 5+ years hands-on experience in Semiconductor Package development, manufacturing, supplier management or quality management
  • Specific experience with Advanced Semiconductor Package technologies (e.g. BGA/2.5D/3D)
  • Foundation in advanced packaging technologies, manufacturing and supplier management
  • Experience with OSAT, Supplier & Foundry technologies.
  • Experience in physical failure analysis
  • Experience in subcontract supplier management.
  • Strong verbal and written communication.
  • Record of success in cross-functional team environment

Additional Information:

Job Posted:
March 01, 2026

Employment Type:
Fulltime
Work Type:
Hybrid work
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