Senior Engineer, Packaging Engineering

• Defines IC package/SMT/SSD drive requirements, goals, and milestones for all SSD product groups and customer requirements
• Develops SSD assembly and IC packaging material and processes to meet quality, reliability, cost, yield, productivity and manufacturing requirements
• Develops new package and SMT process qualification programs
• Prepares and/or updates specifications for piece parts of integrated circuits or semiconductor assemblies
• Plans and conducts experiments to fully characterize material and processes throughout pathfinding to development to ramp
• Develops solutions to improve quality, reliability, cost, yield, process stability/capability, productivity, and safety utilizing formal education, experience, statistical knowledge, and problem-solving tools
• Establishes process control systems
• Transfers process to high volume manufacturing and provide support in new factory start-up
• Acts as a liaison with suppliers/vendors
• Maintains product quality while developing and introducing package cost reduction programs
• Coordinates the introduction of new package processes into production
• Using appropriate tools, performs integrity analysis of packages
• SMT material and process development
• SMT AI/ML integration development
• SMT technology (material/process/metrology/equipment) pathfinding & roadmap
• Stencil design/development for new components
• DFM assessment and NUDD risk management
• Process-Material-Component-board-drive interactions assessment
• DOE & Mechanical and Material Lab Tools & Failure Analysis knowledge
• Quality Tools: FMEA, 8D, DMAIC, IPC knowledge etc
• Statistical Tools: Statistical analysis (JMP/Minitab), Green Belt/Black Belt certification
• Special engineering characterization & improvement projects
• Factory emergency taskforce support

• Bachelor/Master/PhD engineering/material/science required
• Minimum 5 years of relevant work experience (minimum 2 years for PhD)
• Relevant work experience must be in engineering role within semiconductor industry
• Academic studies must be in applicable field of engineering/science and demonstrate an academic record of excellence
• Demonstrated track record to pathfinding and development new SMT material such as paste and epoxy with vendors and utilizing test methodology to qualify new material in factory
• Demonstrated track record to rapidly analyze and solve complex engineering issues by pursuing a focused solution path with a clear understanding of technical fundamental on root causing thru failure analysis report (EDX/FTIR etc), simulation report, mechanical (shadow moire) analysis report, or any relevant metrology data collection
• Demonstrated track record working hands-on around technical equipment and processes (including metrology and semiconductor failure analysis techniques)
• Proficient in statistical analysis towards problem solving and the use of Minitab or JMP and Excel
• Demonstrated track record to summarize complex data sets for technical and non-technical audiences
• elegant in DOE design and execution
• Highly self-motivated and self-directed with demonstrated ability to work well with people
• have strong inter-cultural intuition
• Proven success leading technical team(s) in previous work experience
• Strong verbal and written communications skills

Track record of AI/ML experience is added advantage