This list contains only the countries for which job offers have been published in the selected language (e.g., in the French version, only job offers written in French are displayed, and in the English version, only those in English).
We are seeking a highly skilled and innovative Senior Engineer, Packaging Engineering to join our team in SDSM. In this role, you will lead packaging engineering initiatives, develop innovative solutions, and drive continuous improvement in our packaging processes. You will work as SSD (Solid State Drive) package integration engineer in packaging engineering group.
Job Responsibility:
Leads new SSD product development from concept design and qualification to mass production
Generate innovative product concepts and transform them into tangible, market-ready products
Work closely with global functional teams in US, India, South Korea, and Israel, review feasibility design drawings and propose design options
Collaborate extensively with internal teams, validate design options through characterization builds, perform comprehensive DFX (Design for eXellence) analysis, including DFM (Design for Manufacturability), DFA (Design for Assembly), DFRW (Design for Rework), as well as Cost and UPH (unit per hour) analysis, review mechanical and electrical simulations, initiate assembly process flow, and deliver most optimized design for manufacturing with yield and quality
Ensuring build readiness, execute package qualification plan, follow up package reliability status, investigate and close failures on time
Monitor assembly and test yield on engineering/customer sample and low volume production builds
Drive yield improvement and manage excursions
Lead new product from low volume to high volume production transition with yield and quality meeting goals
Ensure FMEA, SOD, Control Plan, recipe guideline, SPC and other assembly controls are ready prior to high volume production
Lead new technology transition (new wafer tech/process/material) from engineering stage to volume production
Requirements:
Bachelor’s degree with at least 2 years of relevant work experience, or Master’s degree in material science, mechanical engineering, computer science, or other engineering disciplines
Proficient understanding of packaging domains such as SMT, PCB assembly, solder joint reliability, board level reliability, packaging materials, failure analysis, and PCB layout
Additional knowledge in areas like die attach, wire bond, wafer thinning, and molding is a plus
Self-motivated and self-directed
Strong work ethic, capable of performing effectively under high-pressure situations, and maintaining composure in the face of uncertainties
Excellent communication skills, enabling collaboration with global functional teams
Exceptional problem-solving skills with expertise in experimental design and statistical analysis
Experience with programming languages such as Python or SQL is a plus
Nice to have:
Additional knowledge in areas like die attach, wire bond, wafer thinning, and molding
Experience with programming languages such as Python or SQL