Semiconductor Materials Engineer Job at Sigma Design (Redmond)

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Semiconductor Process Engineer

The successful applicant will be part of a team that produces world-class sensor...

Location

United States , Wilmington

Salary:

Not provided

Quantum Computing Inc.

Expiration Date

Until further notice

Requirements

MS or BS in Electrical Engineering, Materials Science or a related discipline
4+ years of hands-on experience with compound semiconductor device fabrication
Significant experience with semiconductor process technology and understanding of semiconductor device physics
Must be able to work independently with minimal supervision
Strong organizational, analytical, and problem-solving skills
Ability to perform critical clean room processing techniques
Excellent dexterity for handling semiconductor wafers
Comfortable and focused on safety while handling clean room chemicals
Proficiency with DOE and SPC concepts
Ability to document work and accurately update written procedures

Job Responsibility

Develop new fabrication processes and define new process flows
Continuously improve existing fabrication processes and process flows
Work with device designers to fabricate and optimize new photonic devices
Develop thin film deposition procedures required for new device structures
Develop thin film wet etching, RIE, and DRIE as required for device development
Perform photolithography mask CAD design and layout
Develop wafer diffusion processes for III-V semiconductors
Implement, document, and maintain process run sheets and work instructions
Analyze correlations between process attributes (e.g., metrology data, process conditions, process variation) and device performance (e.g., functional test results)
Track process variation and drive continuous improvement initiatives

Fulltime

Sales and Marketing Engineer (Advanced Materials)

This role focuses on driving growth through technical expertise. You will act as...

Location

Malaysia , Penang

Salary:

4000.00 - 6000.00 MYR / Month

Randstad

Expiration Date

July 06, 2026

Requirements

2–3 years of B2B technical sales experience in chemicals or semiconductors
Degree in Chemical Engineering, Material Science, or Chemistry
Proven ability to hit targets with an aggressive, sales-driven mindset
Strong communication skills for technical and commercial discussions
Valid driver’s license and willingness to travel regionally
Experience in the electronics or automotive supply chain

Job Responsibility

Drive sales growth within the semiconductor and automotive sectors
Provide technical consultations to align polymer products with client needs
Proactively identify and secure new B2B business opportunities
Manage and grow a portfolio of regional key accounts
Deliver technical presentations to engineering stakeholders
Gather market intelligence to maintain a competitive edge

What we offer

allowance
bonus
profit sharing

Semiconductor Packaging Engineer

The Semiconductor Packaging Engineer is responsible for developing, executing, a...

Location

United States , Redmond

Salary:

Not provided

Sigma Design

Expiration Date

Until further notice

Requirements

Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Aerospace Engineering, Chemical Engineering, Applied Physics, Materials Science, or related technical field or equivalent professional experience required
Minimum of 1+ years of relevant work experience in semiconductor manufacturing, advanced packaging, or related electronics manufacturing environments preferred
Strong background in semiconductor or advanced packaging processes, including wafer-level or panel-level manufacturing
Hands-on experience working with semiconductor assembly and packaging equipment
Experience designing and executing Design of Experiments (DOE), analyzing results, and optimizing manufacturing yield
Experience collaborating across research and development, hardware engineering, and manufacturing teams
Strong analytical, troubleshooting, and problem-solving skills with an innovation and scalability mindset
Experience with advanced packaging technologies such as Flexible Printed Circuits (FPC), Printed Circuit Board Assembly (PCBA), 2.5D/3D integration, or related electronic packaging technologies
Experience working with back-end-of-line (BEOL) and advanced packaging processes including technologies such as thinning, grinding, dicing, soldering, eutectic bonding, electrochemical deposition or metal finishing, through-silicon vias (TSV), flip-chip bonding, wire or die bonding, bumping, thermocompression bonding, copper pillar bonding, hybrid bonding, underfill processes, and overmolding or encapsulation
Experience handling and integrating thinned electronic components as part of advanced packaging workflows

Job Responsibility

Lead assembly and integration engineering efforts with emphasis on Surface Mount Technology (SMT), Die Bond/Wire Bond processes, and support activities related to molding, laser fabrication, panel or wafer lamination, and component thinning, planarization, and dicing
Develop and implement advanced packaging solutions to enable heterogeneous, flexible, and stretchable integration of electronic components and devices
Design and oversee internal, external, and hybrid manufacturing workflows to accelerate development, integration, and scale-up of advanced electronic packaging technologies
Develop new methods and processes to close technology gaps, improve device performance, and increase manufacturing yield through process innovation and optimization
Design and execute experiments (DOE), analyze experimental results, and apply findings to improve packaging processes, device performance, and yield
Execute hands-on fabrication workflows using advanced packaging and assembly equipment, identify in-line process issues, and propose solutions or workarounds to improve manufacturing performance
Collaborate closely with researchers, hardware engineers, system integration teams, and external manufacturing partners to support the development and production of advanced electronic packaging solutions
Support the development and use of high-performance electronic materials in advanced packaging environments
Contribute to instrumentation development, process characterization, mechanical or layout design, and data analysis methods used in hardware research and development environments
Follow Business Technology policies to protect sensitive data and reduce information security occurrences

What we offer

competitive compensation
a 401(k) with up to 4% company match
quarterly bonus program
15-days of accrued PTO
9 company paid holidays
multiple options for medical insurance
dental insurance
voluntary benefits: vision, long-term disability, and life insurance

Fulltime

Senior Quality Engineer

Do you have a passion to improve the Quality of ASML’s products and processes? A...

Location

Taiwan , Linkou

Salary:

Not provided

ASML

Expiration Date

Until further notice

Requirements

MSc/BSc, mechanical engineering, mechatronics, electronics, (applied) physics or comparable
5+ years relevant experience in hi tech manufacturing environment with a focus on quality engineering, reporting
Auditing experience, preferably in semiconductor industry
Seniority experience in: supplier management, manufacturing, logistics, development & engineering
Broad knowledge of Quality tools (SPC, TQM, FMEA, 8-D, Gauge R&R etc.)
Experience in handling projects
Proactive attitude toward LEAN and Quality improvements
Well capability of English speaking, reading and writing

Job Responsibility

Leading cross-functions to resolve material quality issue to support production running smoothly
Well coordination Quality audit management including internal and external audits tasks (process and system audit, e.g. ISO 9001
Supplier lead audit) and follow up for the improvement
Evaluate process performance for the purpose of identifying required problem solving, improvements and opportunities
Analysis source of cause for material quality issues and drive for improvement from issue owners to ensure production running smoothly and efficiently
Communicate with internal customer (factory wise) to get quality feedback and leading containment/solution in the factory to make sure no recurrence
Lead the tasks for ISO-9001 internal/external audit, drive for actions and follow up the improvement status to ensure the compliance
As Supplier Lead Auditor you act as an independent expert to identify risks, verify risk mitigations and drive quality improvements at suppliers and in the ASML supply chain
Contribution for Quality Mindset, Issue Resolution and Quality Control capability in the company

What we offer

10% travel

Fulltime

Program Manager – Value Added Services

The Program Manager (PM) will reside within the Global Operations and Quality (G...

Location

United States , Austin

Salary:

119120.00 - 178680.00 USD / Year

AMD

Expiration Date

Until further notice

Requirements

Significant program or project management experience in semiconductor operations, supply chain, manufacturing, or other complex business environments, with a track record of leading cross-functional initiatives that support strategic business objectives
Experience engaging across product, customer, supplier, and operational stakeholders to translate evolving business requirements into executable plans and scalable solutions
Proven ability to influence across a highly matrixed organization, build alignment among diverse stakeholders, and communicate effectively with both operational teams and senior leadership
Bachelor’s degree preferred in Engineering, Operations, Supply Chain, or related field
Program or project management certification is desired

Job Responsibility

Lead strategic execution of VAS programs, ensuring priorities, milestones, risks, and interdependencies are actively managed in support of business objectives
Drive integration of new product, customer, and business unit requirements into VAS strategies, operating models, and execution frameworks
Identify and advance opportunities to improve efficiency, scalability, and business impact across the VAS portfolio through process, governance, and tool enhancements
Partner across GOQ, Business Units, Sales, Finance, Legal, and other key stakeholders to align priorities, improve visibility, and strengthen execution discipline
Develop executive-ready materials and insights for program reviews, stakeholder updates, and decision forums to support alignment, prioritization, and strategic action

Fulltime

Advanced Processing - Lithography Production Engineer

As an Advanced Processing Lithography Production Engineer, you will directly sup...

Location

United States , Wilton

Salary:

Not provided

ASML

Expiration Date

Until further notice

Requirements

4+ years of experience in semiconductor, optics, or advanced manufacturing environments
Hands-on experience with contact photolithography, resist coating, and wet etching in semiconductor, optics, or other contamination-controlled manufacturing environments, with strong understanding of defectivity and process sensitivities
Ability to communicate clearly and effectively across engineering, operations, and all levels of management to drive alignment and execution
Ability to independently analyze data, identify trends, and apply structured problem-solving methods to define root causes and support corrective actions
Strong technical problem-solving skills, with curiosity, attention to detail, and a systematic, data-driven approach
Ability to work proactively, adapt quickly, and contribute effectively in a fast-paced manufacturing environment
Ability to organize work logically, manage multiple priorities, and drive issues to closure with appropriate escalation as needed
Experience operating in controlled manufacturing or laboratory environments, with disciplined adherence to procedures and standards
High comfort level working directly with hardware and spending significant time in cleanroom and manufacturing environments
Mindset oriented toward identifying and reducing risk, improving process robustness, and driving continuous improvement

Job Responsibility

Own and drive performance of lithography processes, contributing to safety, quality, yield, and process stability
Support the development, execution, and maintenance of process control strategies, acceptance criteria, and monitoring methods
Track and analyze process performance metrics to support technical decision-making and continuous improvement
Lead and execute investigations and resolution of process-related issues, deviations, and escalations
Drive continuous improvement initiatives to reduce variation, improve capability, and increase first-pass yield through data-driven analysis and structured problem-solving methods
Identify and raise process-related safety risks, supporting mitigation through process design, controls, and documented operating practices in partnership with Environmental, Health and Safety (EHS)
Develop and maintain technical documentation, including work instructions, qualification reports, test plans, and safety-related analyses, to support compliant and repeatable execution
Partner with engineering, operations, and development teams to support daily production, sustain stable processes, and enable new product introduction

Fulltime

Business Development Manager (Semicon & Advanced Materials)

The Business Development Manager is a specialized, market-expanding role dedicat...

Location

Malaysia , Penang

Salary:

10000.00 - 15000.00 MYR / Month

Randstad

Expiration Date

July 23, 2026

Requirements

At least 2–3 years of B2B technical sales or business development experience in related fields
Proven background navigating the commercial dynamics of the semiconductor, electronics, or chemical sectors
Solid baseline knowledge of advanced materials, electronic polymers, or assembly processes
Strong consultative sales capability, with a comfort level discussing technical specifications and application data
Demonstrated capability to systematically map, analyze, and convert high-tech territory pipelines

Job Responsibility

Identify, engage, and secure new business partnerships with regional semiconductor, automotive, and electronics manufacturers
Execute robust territory growth plans to aggressively capture market share in high-tech manufacturing segments
Cultivate deep, technical relationships with engineering and procurement decision-makers at target client companies
Deliver technical consultations, mapping specialized polymer capabilities to clients' physical hardware application constraints
Position an advanced product portfolio including thermal interface materials, electronic adhesives, encapsulants, and EMI shielding
Coordinate seamlessly with internal chemical engineering teams to validate custom formulations against client design requirements
Monitor electronics and semiconductor market cycles to preemptively address shifting technology demands

What we offer

performance bonus
allowance
travel allowances
structured performance incentives
corporate vehicle provisions

Fulltime

Principal Technical Program Manager (Quantum Hardware and Firmware Systems)

Microsoft Quantum team is dedicated to developing the first scalable, fault-tole...

Location

United States , Redmond

Salary:

139900.00 - 274800.00 USD / Year

Microsoft Corporation

Expiration Date

Until further notice

Requirements

Bachelor's Degree AND 6+ years experience in quantum information, physics, materials science, electrical engineering, hardware systems, engineering, or related technical fields OR equivalent experience
3+ years of experience managing cross-functional and/or cross-team projects.
Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include, but are not limited to the following specialized security screenings:Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.
Citizenship & Citizenship Verification: This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations or Export Administration Regulations, the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide proof of citizenship, U.S. permanent residency, or other protected status (e.g., under 8 U.S.C. § 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate's citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable.
Ability to leverage AI tools to drive innovation and efficiency (e.g., performance modeling and analysis, research gathering, day to day task automation).
Apply AI to accelerate engineering and lab workflows. Design and build AI agents/copilots that assist with experiment setup, log triage, measurement report generation, protocol templating, and knowledge retrieval (e.g., instrument manuals, design docs).
Evaluate agentic solutions with measurable metrics and humanintheloop safeguards following Microsoft Responsible AI requirements for generative AI.
10+ years of experience owning and managing multi-year, highly complex hardware and firmware product portfolios involving deep-tech or first-of-a-kind technologies, including board bring-up, System-on-Chip (SoC) bring-up, BIOS and driver development, Application Specific Integrated Circuits (ASICs), Field Programmable Gate Arrays (FPGAs), quantum systems, advanced chip packaging, cryoelectronics, or other high-reliability hardware.
Experience managing firmware and hardware product development across the full lifecycle, including R&D, system integration, hardware-software integration, new-technology introduction, and technology transfer from R&D into scaled engineering and manufacturing, including hardware quality systems and development or auditing of test and validation protocols.
Experience with hands-on firmware, low-level systems, or advanced hardware R&D, including BIOS, drivers, embedded systems, quantum device development, quantum error correction, measurement/control systems, or similar advanced hardware domains.

Job Responsibility

Drive Program Execution: Lead comprehensive program management for pivotal quantum hardware initiatives. Oversee all phases, including concept development, engineering design, prototyping, validation, operational scaling, and ongoing delivery. Collaborate closely with system architects, research scientists, and hardware engineers to ensure successful outcomes for each project
Strategic Planning & Roadmapping: Work with program management leadership, engineering teams, and executive stakeholders to develop and maintain a clear roadmap for hardware platform advancement. Align technical milestones, allocate resources, manage schedules, and address risks to support Microsoft Quantum’s overarching long-term goals
Cross-Disciplinary Coordination: Facilitate collaboration and alignment among teams specializing in quantum device physics, cryoelectronics, materials science, hardware control, manufacturing, supply chain, integration, and cloud hardware operations. Ensure that integrated efforts result in reliable and scalable hardware solutions
Supplier & Partner Engagement: Manage relationships with external foundries, research laboratories, equipment vendors, and strategic partners. Foster cross-company collaboration, establish clear requirements, and ensure compliance with Microsoft’s standards for quality, safety, and data security
Risk Management: Identify, monitor, and mitigate technical, scheduling, and operational risks throughout program execution. Apply continuous improvement strategies and adjust programs in response to lessons learned and evolving technology trends
Agile Delivery: Oversee Agile program processes and ceremonies, promote transparency by conducting regular reviews and updates, and proactively remove obstacles to ensure timely achievement of critical deliverables
Customer Focus: Incorporate feedback from internal and pilot customers—including researchers, manufacturing partners, and Azure Quantum platform teams—to guide improvements in hardware and processes
Executive Communication: Develop concise, data-driven reports and executive updates that communicate program status, milestones, risks, dependencies, and impact, upholding Microsoft’s high standards for stakeholder engagement and reporting
Embody our culture and values

Fulltime

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Semiconductor Materials Engineer

Job Description

Job Responsibility

Requirements

What we offer

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