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The successful candidate will be a key member of Tyndall’s MEMS Group under the IPES research programme, leading research on microfabrication, process integration, and heterogeneous integration of integrated magnetic devices for next-generation power management. The candidate will also contribute to the development of new research ideas and proposals for future projects related to microfabrication and advanced integration technologies for power management components. In addition, they will prepare and submit progress reports and project documentation to the Project Manager or Programme Manager throughout the project and will have the opportunity to publish high-quality research in international conferences and journals.
Job Responsibility:
Hands-on microfabrication and process development
Design, develop, execute, and optimise microfabrication processes for integrated magnetic devices on silicon — on-chip inductors and transformers — including thin-film soft-magnetic core deposition (e.g., CoZrTa, FeCoB, laminated stacks), Cu winding electroplating, dielectric deposition, planarization, lithography, and dry/wet etch modules, with direct ownership of wafer lots in the cleanroom
Develop, qualify, and optimise wafer- and die-level interconnection processes — including micro-transfer printing, flip-chip / solder-bump assembly, under-bump metallisation, redistribution layers (RDL), and through-silicon/through-glass via formation — to enable heterogeneous integration of Tyndall's magnetics with PMICs and other power passives on interposers within the FAMES Pilot Line
Plan and run structured design-of-experiment (DoE) campaigns to drive improvements in yield, uniformity, repeatability, and device reliability, working directly with tool owners and process engineers across Tyndall's MEMS fab lines
Device characterisation and design–fab–measurement loop
Perform electrical, RF, magnetic, and structural characterisation of fabricated devices (impedance and S-parameter measurements, small- and large-signal power testing, SEM/FIB/TEM, XRD, AFM, optical/stylus profilometry) and correlate measured performance with process variables to guide iterative process refinement
Contribute to mask layout for test vehicles and product-level devices, and interface with Design team to close the design–fabrication–measurement loop
Project delivery, collaboration, and reporting
Deliver assigned FAMES Pilot Line technical milestones and deliverables on schedule
prepare technical progress reports, risk registers, and formal documentation for the Programme Manager and downstream submission to the Chips JU and national funding agencies
Collaborate actively with FAMES consortium partner and coordinator CEA-Leti, joint experiments, sample exchange, and on-site integration campaigns at partner facilities as required
Provide clear verbal and written technical updates to internal and external stakeholders, including Tyndall management, industrial partners, and project reviewers
Research outputs and future growth
Generate intellectual property by identifying novel technical contributions, supporting invention disclosures and patent drafting, and ensuring appropriate protection of outcomes prior to public disclosure
Publish high-quality peer-reviewed journal articles and present research outcomes at leading international conferences (e.g., IEEE IEDM, ECTC, ESTC, Transducers, IFCS, PwrSoC, APEC)
Contribute to the preparation of new research proposals (Horizon Europe, Chips JU follow-on calls, SFI, Enterprise Ireland, and bilateral industry-funded programmes) aligned with microfabrication and advanced integration technologies for power management
Mentoring, facility stewardship, and compliance
Provide day-to-day technical guidance, support and mentoring to PhD students, masters students, and junior researchers contributing to the project, including training on relevant processes and characterisation tools
Ensure full compliance with Tyndall's cleanroom, laboratory, and health & safety protocols
maintain accurate process records in the institute's electronic systems
and contribute to continuous improvement of standard operating procedures and process documentation
Participate in Education and Public Engagement activities
Ensure compliance with Tyndall’s Quality Management Systems, Health and Safety standards, and other regulations
To carry out any additional duties that may reasonably be required within the general scope and level of the post
Requirements:
PhD in a relevant Science or Engineering discipline (Electrical/Electronic Engineering, Applied Physics, Materials Science, or equivalent), with specialisation in MEMS, microsystems, or semiconductor device fabrication
4+ years of post-PhD research experience in a university, research institute, or industrial R&D environment, with demonstrable hands-on ownership of multi-step microfabrication process flows (i.e., not purely design, modelling, or supervisory experience)
Minimum of three years of cumulative hands-on cleanroom experience (inclusive of PhD), covering independent execution of wafer-level process modules and lot tracking
Proven expertise in device characterisation and/or process metrology in at least two of the following: electrical (DC/RF/impedance), structural (SEM / FIB / AFM / XRD / profilometry), or material analysis (optical, magnetic, mechanical)
Strong research track record evidenced by a minimum of four peer-reviewed international journal/conference publications, of which at least three as first or corresponding author in reputable venues, complemented by presentations at leading international conferences
Evidence of the ability to plan and deliver technical work packages against defined milestones, including contributing to technical reporting, risk tracking, and project documentation
Excellent written and spoken English, with demonstrated experience preparing peer-reviewed manuscripts, technical deliverables, and conference presentations to an international audience
Nice to have:
Hands-on experience across multiple unit-process modules: photolithography and pattern transfer, physical vapour deposition (sputtering, evaporation), CVD/PECVD/ALD, wet and dry etching (RIE/ICP, DRIE), CMP, and electroplating (particularly Cu and magnetic alloys)
Hands-on experience with in-line and end-of-line process metrology and failure analysis using SEM, FIB, AFM, XRD, stylus/optical profilometry, ellipsometry, vector network analyser, impedance analyser, and RF/DC probe stations
Experience in micro-assembly, wafer-/die-level heterogeneous integration, and advanced packaging of microdevices — e.g., micro-transfer printing, flip-chip and solder-bump assembly, under-bump metallisation, redistribution layers, TSV/TGV, wafer bonding
Working knowledge of end-to-end process integration for MEMS or semiconductor devices, including CMOS-compatible back-end-of-line constraints, thermal budget management, and topography/planarization considerations
Experience applying structured process optimisation methodologies: Design of Experiments (DoE), Failure Mode and Effects Analysis (FMEA), Root Cause Analysis (RCA), and Run-to-Run (R2R) control
Familiarity with statistical process control (SPC) and cleanroom quality/traceability systems
Experience contributing to large collaborative research programmes, particularly EU-funded projects (Horizon Europe, Chips JU, Horizon 2020 etc.)
Track record of intellectual property generation — invention disclosures, patent filings, or granted patents
Experience co-supervising postgraduate students, interns, or junior researchers
Experience contributing to competitive research proposal writing
What we offer:
Impactful Work: Opportunities to contribute to ground-breaking research and innovation that shape Ireland’s economy and the society at large
Continuous Learning: Strong support for formal training, further study and professional development
Interdisciplinary Environment: Where academia, industry, and innovation intersect - supported by cutting-edge infrastructure and expert knowledge
Blended Working: Flexibility to work remotely and on-site, where the role allows
Comprehensive Benefits: Access to UCC pension, long-term illness benefit, life assurance, and more
Equity & Inclusion: Athena Swan Bronze award holder, with ongoing initiatives led by a dedicated People and Culture team to ensure equity for all
Core Values: A culture grounded in Ambition, Collaboration, Diversity, Excellence, and Integrity
Entrepreneurial Spirit: A proactive, innovation-driven environment that welcomes entrepreneurial and creative thinkers, including those with start-up experience
Supportive Onboarding: Structured induction and mentoring to help new hires integrate and thrive
Vibrant Culture: A collaborative, people-first workplace with a strong sense of community