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Palma Ceia Semi-Design (PCS), is a fast-growing, fabless semiconductor company, focused on complete integrated Wi-Fi and LTE solutions for the IoT marketplace. We require senior-level product/Quality engineers to join their Silicon Operations team in Cambridge, UK.
Job Responsibility:
Ensure the smooth transition of products from early-stage sampling to high volume production on time and within the quality and cost expectations of the company
Plan and execute qualification and reliability programs for a range of new products to recognized industry standards such as JEDEC
Plan and execute initial ramp to production
Processes and Procedures: create suitable product procedures required including but not limited to product NPI & ramp
Establish effective business systems for quality assurance including product qualification, pre-production ramp (safe launch), risk analysis
Reviews product discrepancies or build/yield issues (RMA)
perform investigation and root cause analysis (e.g. 8D), coordinate with manufacturing and engineering to drive problem resolution
Write/revise internal procedures and instructions as needed to ensure quality standards are met and in support of continuous improvement
Provide guidance to all team members and ready business to achieve and retain ISO 9001 certification
Requirements:
BS/MS degree Physics, EE or equivalent industrial experience
Minimum 4 years of direct experience high tech manufacturing environment
Experience with quality management systems
Familiarity with electronic manufacturing systems particularly in the Semiconductor industry
Strong knowledge of product qualification methods incl. FA
Familiarity with the design
Experience with NPI processes involved in a fabless semiconductor company
Working with external suppliers/partners
Silicon Foundry and OSAT experience
Statistical analysis – e.g. JMP
Strong communication skills (written, verbal, and presentation)
Strong team-player
Can-do attitude
Ability to work independent of management, yet within a team environment of constantly changing priorities
Ability to work on multiple quality projects simultaneously
Strong attention to detail
Willingness to get involved in whatever needs doing
Nice to have:
Good understanding of analog/RF and digital IC design methodologies and circuit architectures
Familiarity with fab tape-out process
Test engineering knowledge
Package substrate design
Knowledge of BT, Wi-Fi, Zigbee or nb-IoT
Effective use of Microsoft Office presentation tools – Word, PowerPoint, and Excel plus Outlook and Teams
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