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As a Process Engineer at Lam, you will operate on cutting-edge technology, harnessing atomic precision, material science, and surface engineering to push technical boundaries. Your role involves developing new and advanced process formulations, defining equipment hardware to meet processing requirements, evaluating test data, and coordinating design requirements to ensure compatibility of processing methods. Your expertise and knowledge play a crucial role our customers success, making an impact on the next generation of semiconductor breakthroughs. In this role, you will directly contribute to the development of test wafers to enable the product groups customer demo’s, concept and feasibility and R&D projects.
Job Responsibility:
Conduct process engineering development, and evaluation in support of Lam’s cutting-edge semiconductor equipment and systems
Review and enhance processing techniques and methods applied in the manufacture and fabrication of products
Develop and sustain new processes and process improvements to reduce production costs and increase yields
Compile and analyze test data to establish next steps in process development and determine appropriate limits and variables for process specifications
Collaborate internally to plan, collect data, analyze results, and report on customer demos for existing process applications
Partner cross-functionally and with customers to understand roadmaps, process flow, inflection points, requirements, and business challenges
Contribute to next generation product development and release activities supporting the semiconductor roadmap
Provide leadership, clear direction, and guidance to process technicians to support execution activities
Requirements:
Master’s degree in Materials Science, Chemical Engineering, Chemistry or Physics or related field with 6+ years of experience
or a PhD with 3+ years’ experience
or equivalent experience
Nice to have:
Familiarity with working in a laboratory and on semiconductor equipment with experience in surface preparation and analytical techniques
In-depth understanding of Statistical Process Control (SPC) and/or Design of Experiments (DOE)
Working knowledge of statistical analysis and problem-solving methodologies
Experience with statistical tools (JMP, Minitab, etc.)
Background and proven experience in Plasma Physics, Reactive Ion Etching (RIE), Atomic Layer Etching (ALE), Inductively Coupled Plasma (ICP), Capacitively Coupled Plasma (CCP)
Background in Atomic Layer Deposition (ALD), Chemical Vapor Deposition (CVD), Plasma Enhanced Chemical Vapor Deposition (PECVD), or Physical Vapor Deposition (PVD)
Knowledge of Material synthesis and material characterization
Experience working in a collaborative and matrixed environment with diverse teams, semiconductor customers, and/or partners
Experience in semiconductor, process design, deposition, etch dielectrics or conductor, metal films, etc.