Job Description
Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for a Principal Signoff CAD Engineer to help achieve that mission. As Microsoft's cloud business continues to grow the ability to deploy new offerings and hardware infrastructure on time, in high volume with high quality and lowest cost is of paramount importance. To achieve this goal, the Methodology, Infrastructure, Silicon Engineering, and Labs engineering (MILE) team is instrumental in defining and delivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware. We are looking for a Principal Signoff CAD Engineer with a passion for customer focused solutions, insight and industry knowledge to envision and implement future technical solutions that will manage and optimize the Cloud infrastructure. We are looking for a Principal Signoff CAD Engineer specializing in silicon signoff to join the team. In this role, you will own the signoff CAD strategy and flow architecture across parasitic extraction, static timing analysis, power integrity, and physical verification for Microsoft’s next-generation silicon programs. You will bring experience across the full signoff tool ecosystem—including StarRC/Pegasus, PrimeTime/Tempus, Redhawk-SC/Voltus, and Fusion Compiler/Innovus—and a record of driving quality, growth, and technical leadership at scale.
