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Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for a Principal Physical Design Manager to help achieve that mission.
Job Responsibility:
Lead a team in defining implementation and execution plan for a schip/SOC
Execute the plan for successful tapeout by working with various stakeholders (RTL, IP, Methodology, DFT, Architecture etc)
Drive the team to achieve the best performance, power, and area (PPA) for AI system-on-chips (SOCs)
Optimizing technology, libraries, physical design, RTL design, and architecture
Collaborate with various stakeholders such as RTL designers, IP teams, Methodology experts, DFT engineers, and Architects
Provide technical guidance and mentorship to team members
Oversee the development and implementation of physical design flows and methodologies
Collaborate with cross-functional teams to address design challenges and optimize for manufacturability
Monitor progress, identify risks, and implement mitigation strategies
Keep abreast of the latest industry trends, tools, and techniques in physical design
Work with limited direction, have keen attention to detail, and provide crisp status of progress, issues, and risks
Requirements:
Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience
Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience
Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience
Ability to meet Microsoft, customer and/or government security screening requirements
Ability to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter
Ability to provide proof of country of citizenship or proof of US residency or other protected status for export control assessment
Bachelor's or master’s in electrical or computer engineering or related field with 10+ years of experience
Experience in physical design implementation, signoff at block / sub system / sub-chip / SoC level
Experience in tapeout of complex ASICs in leading edge process node technology
8+ years of hands-on experience in EDA vendor tools such as Fusion Compiler, VCLP, Primetime, Formality, or Cadence Innovus and Conformal