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Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for passionate engineers to help achieve that mission. As Microsoft's cloud business continues to grow the ability to deploy new offerings and hardware infrastructure on time, in high volume with high quality and lowest cost is of paramount importance. To achieve this goal, the AI Silicon Engineering team is instrumental in defining and delivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware. We are looking for seasoned engineers with a dedicated passion for customer focused solutions, insight and industry knowledge to envision and implement future technical solutions that will manage and optimize the Cloud infrastructure. We are looking for a Principal Physical Design Manager to join the team.
Job Responsibility:
Lead a team in defining implementation and execution plan for a schip/SOC
Execute the plan for successful tapeout by working with various stakeholders (RTL, IP, Methodology, DFT, Architecture etc)
Drive the to achieve the best performance, power, and area (PPA) for AI system-on-chips (SOCs)
Optimizing technology, libraries, physical design, RTL design, and architecture
Leading the team in defining the implementation and execution plan for a subchip/SOC
Collaborating with various stakeholders such as RTL designers, IP teams, Methodology experts, DFT engineers, and Architects to ensure a cohesive plan
Executing the defined plan to ensure successful tapeout of the subchip/SOC
Driving the team to achieve the best performance, power, and area (PPA) for AI system-on-chips
Optimizing technology choices, libraries, physical design methodologies, RTL design strategies, and architectural decisions to meet performance targets
Ensuring that the physical design aspects align with the overall project goals and timelines
Providing technical guidance and mentorship to team members
Overseeing the development and implementation of physical design flows and methodologies
Collaborating with cross-functional teams to address any design challenges and optimize the design for manufacturability
Monitoring progress, identifying risks, and implementing mitigation strategies to ensure project success
Keeping abreast of the latest industry trends, tools, and techniques in physical design to drive innovation and efficiency within the team
Work with limited direction, have keen attention to detail, and be able to provide crisp status of progress, issues, and risks on the program to the management team
Requirements:
Bachelor's or master’s in electrical or computer engineering or related field with 15+ years of experience
Experience in physical design implementation, signoff at block / sub system / sub-chip / SoC level
Experience in tapeouts of complex ASICs in leading edge technology
Ability to meet Microsoft, customer and/or government security screening requirements
This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter
This role will require access to information that is controlled for export under export control regulations
As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their US. residency or other protected status
To meet this legal requirement, and as a condition of employment, the successful candidate’s citizenship will be verified with a valid passport