Principal Mechanical/Thermal Architect Job at Microsoft Corporation (Taipei)

Job Description

Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for passionate engineers to help achieve that mission. As Microsoft's cloud business continues to grow the ability to deploy new offerings and hardware infrastructure on time, in high volume with high quality and lowest cost is of paramount importance. To achieve this goal, the CHSE (Cloud Hardware Systems Engineering) team is instrumental in defining and delivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware. We are looking for seasoned engineers with a dedicated passion for customer focused solutions, insight and industry knowledge to envision and implement future technical solutions that will manage and optimize the Cloud infrastructure. We are looking for a Principal Mechanical/Thermal Architect to join the team.

Job Responsibility

Lead Mechanical and thermal Development: Deliver innovative mechanical and thermal architecture and designs for compute & AI server and cooling systems, integrating thermal, structural, and electrical constraints with a deep understanding of server architecture and adjacencies
End-to-End System Design Ownership: Lead system-level design from concept through production, including architectural trade-offs, technical decision-making, and alignment across chip, tray, rack, and datacenter interfaces
Liquid Cooling Architecture Leadership: Architect and drive the design and development of complex liquid cooling solutions at the server, rack, and datacenter levels, including liquid-to-air heat exchangers, CDUs, manifolds, and piping
Fluid Distribution & Thermal Implementation: Own the mechanical and thermal implementation of fluid distribution systems within server racks, including: Fluid flow and pressure management
Cold plate design and reliability
Pump selection, design, and reliability
Material compatibility and corrosion resistance
Fluid and air volume management
Design for Manufacturing & Reliability: Ensure manufacturability, cost-efficiency, and long-term reliability through material selection, tolerance control, supplier engagement, and understanding of tooling and manufacturing processes
Drive for Results: Set goals with measurable outcomes, manage risk, and ensure timely delivery of high-quality hardware solutions across product lines
Strategic Thinking: Translate business and customer needs into scalable mechanical strategies that align with long-term platform and product roadmaps, while proactively exploring future technologies and industry trends
Technology Pathfinding: Develop and explore innovative design strategies that anticipate future trends, opportunities, and industry shifts
Engineering Rigor & Agility: Balance innovation with disciplined execution, ensuring quality as a key participant in structured design reviews, test planning, and root cause analysis
Cross-Functional Collaboration: Partner with system, electrical, thermal, mechanical, power, reliability, datacenter and other domains to align interfaces, constraints, customer-focused solutions and execution plans across the platform
Invent & Protect: Identify and develop intellectual property, encouraging patent filings and contributing to Microsoft’s innovation portfolio
Tool & Process Advancement: Evaluate and implement new tools, technologies, and methodologies to improve design quality and team productivity
Utilize expertise in fluid systems design to deliver high-performance liquid cooling with production-level reliability

Requirements

9+ years related technical engineering experience OR Bachelor's degree in Mechanical Engineering, or related field AND 6+ years related technical engineering experience OR Master's degree in Mechanical Engineering, or related field AND 4+ years related technical engineering experience OR Doctorate degree in Mechanical Engineering, or related field AND 3+ years related technical engineering experience OR equivalent experience
Proficiency in CAD software understanding of mechanical design principles, GD&T analysis, mechanical vibration and shock, material compatibility, tooling, manufacturing processes, validation, and packaging
Experience with prototyping, tooling, and high-volume manufacturing of electronic enclosures
Experience leading complex design programs, crossfunctional design reviews and architectural decisions
Experience with cabling and networking interconnect technology
Experience with development of specifications, interface control documents, and managing design requirements
Hands-on experience with the end-to-end design of liquid cooling subsystems, such as QD, Cold Plate, Manifold, RPU and CDU
Hands-on experience with FloTHERM, FLOEFD, Ansys, Icepak, Macroflow or equivalent CFD analysis software
Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter

Nice to have

5 + years of thermal and mechanical design principles, fluid dynamics, pumps and compressors, mechanical vibration and shock, valve and manifold design, material compatibility, manufacturing processes, and validation
10 years of experience in the electronics industry specifically related to high-density, liquid cooled compute systems
15+ years of industry experience in the electronics industry with server development background
Proficient analytical and problem-solving skills, with the ability to identify and resolve mechanical design issues and optimize system performance
Advanced knowledge of analytical tools/processes for heat transfer, fluid flow, material science, and structural analysis
Ability to generate and analyze architectural solutions, including directional cost analysis, feasibility and engineering degree of difficulty
Experience in tolerance analysis and the production part approval (PPAP) process

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Principal Mechanical/Thermal Architect

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