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We are seeking a highly experienced and analytical Principal Costing Engineer to join our dynamic Global Operations team. You will be the subject matter expert responsible for the development, maintenance, and strategic deployment of end-to-end product costing models across the entire semiconductor manufacturing flow—from wafer fabrication through assembly and final testing. This is a critical, cross-functional role that ensures product pricing, margin analysis, and profitability strategies are built upon precise, technically-validated, and compliant financial data.
Job Responsibility:
Design, develop, and own sophisticated cost models for semiconductor products (e.g., Die Cost, Wafer Cost, Assembly & Test Cost) using technical inputs like yield, process cycle time, throughput, and material consumption
Conduct in-depth cost variance analysis (standard vs. actual) and margin analysis
investigate deviations and partner with Operations to implement corrective actions
Lead the costing effort for New Product Introductions (NPI), providing early-stage cost estimates and validating Bills of Material (BOM) and process routings to influence design-for-cost decisions
Collaborate closely with Process, Product, and Yield Engineering teams to identify and quantify opportunities for cost-down initiatives, process efficiency improvements, and yield enhancement
Execute detailed "what-if" simulations and sensitivity analyses to assess the financial impact of potential process changes, technology shifts, or supply chain variations
Prepare, standardize, and present regular cost roll-up reports, dashboards, and management summaries. Ensure all cost accounting practices adhere strictly to GAAP/IFRS and internal financial policies
Manage the accurate setup and maintenance of cost data within the Enterprise Resource Planning (ERP) system (e.g., SAP/Oracle)
Requirements:
Bachelor’s Degree in Engineering (Electrical, Electronics, Industrial, or Manufacturing)
Minimum 5+ years of progressive experience in product costing, cost engineering, or financial analysis within the semiconductor, electronics, or complex discrete manufacturing industry
Strong, hands-on understanding of semiconductor manufacturing cost drivers across the value chain: Wafer Fabrication (WFE) process flow and associated costs, Die Sort, Assembly, and Final Test (A&T) process and cost structure
Expert-level proficiency in advanced Microsoft Excel modeling and practical experience using major ERP systems (SAP or Oracle) for cost accounting modules
Proven track record in detailed yield analysis, process time calculation, and package cost impact assessment
Nice to have:
Experience utilizing data visualization tools (e.g., Power BI, Tableau) or automation skills (e.g., VBA, Python) for enhanced reporting and data analysis
Familiarity with statistical process control (SPC) and leading cross-functional cost optimization or value engineering projects
Prior experience or knowledge related to Outsourced Assembly and Test (OSAT) costing models and negotiations
Relevant professional certification (e.g., CMA, CPA, CIMA)
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