Physical Design Engineer Job at Hewlett Packard Enterprise (Bangalore)

Senior Physical Design Engineer

We are looking for an adaptive, self-motivative physical design engineer to join...

Location

Malaysia , Penang

Salary:

Not provided

AMD

Expiration Date

Until further notice

Requirements

MSEE with 2+ years or Bachelor with 5+ years of industrial experience in ASIC design
Familiar with Back-End (physical design) EDA tools
Hands on experience in large scale ASIC chip physical design
Knowledgeable in all aspects of deep submicron ASIC design flow
Successfully gone through several complete product development cycles
Demonstrate strong problem-solving and work well with cross-functional teams
Good listening, writing and speaking English
Good communication skills, strong interpersonal skills and flexibility
Dedicated, hardworking and good team player
Familiar with Unix/Linux environment and good at scripts

Job Responsibility

Drive and improve AMD's abilities to deliver the MI/Navi series of GPU products to market

Microprocessor VLSI Physical Design Engineer

At AMD, our mission is to build great products that accelerate next-generation c...

Location

United States , Fort Collins

Salary:

139360.00 - 209040.00 USD / Year

AMD

Expiration Date

Until further notice

Requirements

BS/MS in EE, CS, CSE (or similar), plus 8+ years hardware design experience
Hands-on experience in high-speed VLSI design
Excellent understanding of computer architecture, hardware concepts & design tradeoffs required
Knowledge of Chip Level Floor planning, Bus / Pin Planning, Clock Tree Synthesis, Placement, Optimization, Routing, Parasitic Extraction, Static Timing Analysis, IR drop analysis, electromigration, Physical Verification and Sign Off
Comprehend complex Verilog RTL and make minor modifications for timing or power
Knowledge of digital circuits, high speed flops, synchronizers, level shifters, and SRAM
Familiar with programing languages such as Perl, C, tcl, etc.

Job Responsibility

Technical lead for high-speed VLSI design in deep sub-micron processes
Work closely with RTL and physical designers across multiple sites to optimize power, performance, area, and schedule
Solve design and tool problems requiring ground-breaking approaches and champion innovation across the organization
Create technical presentations for peers and management
Guide and mentor junior engineers.

Fulltime

Senior SoC/ASIC Physical Design Engineer

As a Senior SoC/ASIC Physical Design Engineer, you will work on developing and i...

Location

United States , Irvine

Salary:

Not provided

Xcelerium

Expiration Date

Until further notice

Requirements

5+ years of ASIC and/or physical design flow development experience
Experience with ASIC physical design, physical design flows and methodologies (i.e., synthesis, place and route, STA, formal verification, CDC or power analysis using industry standard tools)
Scripting experience with Python, Tcl, or Perl
Experience in extraction of design parameters, QOR metrics, analyzing trends, voltage scaling (SVS, DVFS), and SRAM split rail implementation
Strong experience in ASIC/SOC RTL2GDSII physical design and signoff flows
Strong experience with Synopsys EDA tools including understanding of their capabilities and underlying algorithms
Strong knowledge of deep sub-micron FinFET and CMOS solid state physics
Strong knowledge of CMOS digital design principles, basic standard cells their functionality, standard cell libraries
Deep understanding of CMOS power dissipation in deep submicron processes leakage/dynamic
Familiar with CMOS analog circuit and physical design

Job Responsibility

Perform partition synthesis and physical implementation steps (e.g. synthesis, floorplanning, power/ground grid generation, place and route, timing, noise, physical verification, electromigration, voltage drop, logic equivalency and other signoff checks)
Develop/improve physical design methodologies and automation scripts for various implementation steps
Closely collaborate with the ASIC design team to drive architectural feasibility studies, develop timing, power and area design targets, and explore RTL/design tradeoffs
Resolve design/timing/congestion and flow issues, identify potential solutions and drive execution/timing/congestion and flow issues, identify potential solutions and drive execution
Run, debug, and fix signoff closure issues in static timing analysis (STA), noise, logic equivalency, physical verification, electromigration and voltage drop

Fulltime

Senior Physical Design Engineer

As a Senior Physical Design Engineer, you will be responsible for the physical i...

Location

United States , Batavia, Illinois

Salary:

Not provided

NHanced Semiconductors

Expiration Date

Until further notice

Requirements

US Citizenship
5+ years of experience in physical design, specifically in ASIC, SoC, or advanced packaging (2.5D, 3DIC) technologies
Hands-on experience with Git-based version control systems for managing design revisions
Experience with timing closure and signal integrity
Proficiency in Cadence tools for physical design, timing analysis, and signoff
Strong understanding of RTL-to-GDSII flows, including floorplanning, power planning, place-and-route, and timing closure
Working knowledge of parasitic extraction (PEX), power integrity (PI), and thermal analysis in multi-die environments
Ability to work independently with minimal supervision and drive tasks to completion
Excellent verbal and written communication skills for collaboration across engineering teams
Strong debugging skills and ability to analyze tool reports, logs, and simulation results

Job Responsibility

Drive full-chip physical implementation of 2.5D interposer and ASIC designs, including floorplanning, placement, clock tree synthesis (CTS), routing, and optimization
Ensure design compliance with timing, power, and area (PPA) requirements, as well as DFM, DRC, and LVS constraints
Utilize Cadence tools (Innovus, Virtuoso, Tempus, Voltus, Pegasus, etc.) for physical design, verification, and signoff
Develop and execute timing closure strategies, working with STA engineers to meet performance goals
Optimize power distribution networks (PDN) and electromigration (EM) reliability in multi-die packaging environments
Work with package and system engineers to optimize die-to-die interconnect, bump placement, and TSV integration
Collaborate with RTL designers, DFT engineers, and backend teams to ensure seamless integration
Implement ECOs (Engineering Change Orders) and efficiently iterate design revisions
Utilize Git-based version control workflows for design database management and collaborative development
Identify and resolve congestion, signal integrity (SI), and crosstalk issues in complex designs

Asic Physical Design Engineer

Designs, analyzes, develops, modifies and evaluates VLSI components and hardware...

Location

United States , San Jose

Salary:

148000.00 - 340500.00 USD / Year

Hewlett Packard Enterprise

Expiration Date

Until further notice

Requirements

BS degree in electrical engineering
computer engineering
or a related field with 7+ years of experience in block or full-chip physical design
Deep design experience in large SoC designs
including IP integration
padring design
bump planning
and RDL routing strategy
Extensive knowledge and practices in Physical Design
including physically aware synthesis

Job Responsibility

Implement physical design at the large SoC chip level from RTL to GDSII
create a design database ready for manufacturing
Interact with IP vendors to understand IP integration requirements and integrate all blocks
IPs
and sub-chips at a large SoC level
Collaborate with the packaging team on Microbump/Probe Bump/Bump/Pad placement
Build full chip floorplan
including pads/ports/bump placement
block placement and optimization
block pins placement and alignment

What we offer

Comprehensive suite of benefits that supports physical
financial and emotional wellbeing
Personal and professional development programs
Unconditional inclusion and flexibility to manage work and personal needs

Fulltime

Hardware Design Engineering Intern/Co-op

We are seeking a highly motivated Hardware Design engineering intern/co-op to jo...

Location

Canada , Markham

Salary:

65000.00 CAD / Year

AMD

Expiration Date

Until further notice

Requirements

Currently enrolled in a Canada based University into a Bachelor's degree program majoring in Electrical engineering or Computer engineering or a related field
Strong semiconductor device physics knowledge
Digital /Logic circuits and VLSI
Verilog or VHDL hardware description languages
Exposure to UVM methodologies
Scripting languages (e.g. Python, Perl, TCL, Ruby), Shell / UNIX scripting, C/C++, MATLAB
Interest or experience in Machine Learning
ASIC design
Knowledge of Ruby on Rails and MySQL
Linux/Unix environment

Job Responsibility

Collaborate with Design Engineers on the physical design verification and physical implementation for some of our ASIC
Work on Memory interface simulation work eg. GDDR7, HBM, UCIE
Work on Discreate and Embedded hardware products and chip to chip interconnect
Actively participate in RTL design in Verilog
Synthesis with timing driven placement and design for power (DFP)
Floor planning, Power distribution, Clock distribution, Block/Chip Place & Route, EM/IR analysis, Timing closure, Static Timing Analysis
Analysis of logical equivalent check, RTL clocking analysis, static power analysis, and design for test (DFT)
Build test libraries and models by using advanced verification languages such as System Verilog, UVM and C++

Fulltime

Senior Design Team Engineer

At Boeing, we innovate and collaborate to make the world a better place. We’re c...

Location

United States , Hazelwood

Salary:

139000.00 - 171000.00 USD / Year

Boeing

Expiration Date

January 12, 2026

Requirements

Bachelor’s degree or higher from an accredited course of study, in engineering, computer science, mathematics, physics or chemistry
10+ years of experience in mechanical and /or structural design
10+ years of experience creating, executing, reviewing, and managing structural design models
10+ years of experience working conceptual, preliminary and detailed design including 2D drawings and 3D deliverables
10+ years of experience reading and interpreting engineering drawings and specifications
10+ years of experience in CAD/CAM software (Siemens NX, CATIA V5, SolidWorks)
Ability to obtain a US Security Clearance for which the US Government requires US Citizenship

Job Responsibility

Serve as Technical Lead Engineer (TLE) for all Design Engineering activities including technical quality review of the design development, documentation and changes for Model Base Definition (MBD), and 2D engineering definition
Develop design tools, processes and training to increase efficiency and consistency among the items our team supports
Leads activities to validate and verify Design Engineering requirements
Develop and document Design requirements, including technical data packages, destruct test article documents, process specifications, and Design Practices
Develop Design Engineering project requirements, cost proposals and schedules, and implement them through supplier standup
Support on-going supplier and customer activities providing real-time support
Contributes to supplier development, test, production, and troubleshooting activities
Support Configuration Control Board and Engineering Review Board as Design TLE
Provide leadership, coaching, and technical oversight to other mechanical Design Engineers
Supports proposal preparation and new business development efforts

What we offer

Relocation based on candidate eligibility
Competitive base pay and variable compensation opportunities
Opportunity to enroll in a variety of benefit programs, generally including health insurance, flexible spending accounts, health savings accounts, retirement savings plans, life and disability insurance programs, and a number of programs that provide for both paid and unpaid time away from work
Generous company match to your 401(k)
Industry-leading tuition assistance program pays your institution directly
Fertility, adoption, and surrogacy benefits
Up to $10,000 gift match when you support your favorite nonprofit organizations

Fulltime

Electrical Design Engineer

The Electrical Design Engineer (LV/MV) will design and develop protection and co...

Location

United Kingdom , Colchester

Salary:

35000.00 - 50000.00 GBP / Year

Hedera Hiring Ltd

Expiration Date

Until further notice

Requirements

A minimum of HNC/HND/Degree or equivalent in Electrical/Electronic Engineering or Physics
Incorporated Engineer/member of the IET/Chartered Engineer
Experience in design and planning of DNO/IDNO network for 11kV 33kV and 66kV or higher

Job Responsibility

Design and develop protection and control schemes for LV/MV and EHV substations
Produce and maintain accurate main connection and protection drawings
Calculate protection settings
Perform cable calculations for voltages up to 66 kV
Provide design expertise for substations at various voltage levels
Conduct and analyse power system studies such as load flow and short-circuit studies
Ensure all designs comply with relevant regulations and standards

Physical Design Engineer

Hewlett Packard Enterprise

Location:
India , Bangalore

Category:
IT - Software Development

Contract Type:
Not provided

Salary:

Job Description:

Job Responsibility:

Requirements:

Nice to have:

Additional Information:

Job Posted:
August 13, 2025

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Physical Design Engineer

Hewlett Packard Enterprise

Location:India , Bangalore

Category:IT - Software Development

Contract Type:Not provided

Salary:

Job Description:

Job Responsibility:

Requirements:

Nice to have:

Additional Information:

Job Posted:August 13, 2025

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Location:
India , Bangalore

Category:
IT - Software Development

Contract Type:
Not provided

Job Posted:
August 13, 2025