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Photonics Packaging Process Engineer

https://www.csiro.au/ Logo

CSIRO

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Location:
Australia, Brisbane

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Category:
Research and Development

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Contract Type:
Employment contract

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Salary:

Not provided

Job Description:

This role involves leading high-impact research in advanced photonic packaging at CSIRO and Queensland Advanced Photonics Packaging Facility to design, optimize, and implement scalable packaging solutions. It includes operations and leadership in cleanroom facilities, process development, and collaborations with industry, academic, and government partners.

Job Responsibility:

  • Leading the development of low-loss, scalable, and cost-efficient photonic chip packaging solutions
  • Designing and directing implementation of new assembly processes tailored to silicon photonic system requirements
  • Operating electrical wire bonders, two-photon polymerisation tools, die bonders, and optical alignment systems in a cleanroom environment
  • Managing and maintaining cleanroom infrastructure and associated packaging equipment, ensuring high operational standards and procedural compliance
  • Developing SOPs and training material for cleanroom personnel with an emphasis on safety
  • Designing heterogeneous integration (HI) processes for seamless photonic-electronic co-packaging at chip level
  • Performing Multiphysics modelling (thermal, mechanical, optical) using tools such as Ansys Lumerical and ZEMAX
  • Maintaining collaborative partnerships across the Queensland photonics network to drive strategic innovation and technical alignment.

Requirements:

  • Minimum qualification of a Master’s degree in Electrical Engineering, Physics (ideally majoring in Optics), Materials Science, Mechanical Engineering, or a closely related field
  • Strong background in photonics, photonic integration, device-level modelling (e.g., Lumerical, COMSOL, Tiny3D), and optical system design (ZEMAX)
  • Strong background in semiconductor packaging technologies including die attach, wire bonding, flip-chip assembly, and optical micro-assembly
  • Proficiency in scientific programming (MATLAB, LabVIEW, C++, or Python)
  • Experience with PCB Design and CAD design tools
  • Demonstrated leadership in solving complex technical challenges and delivering project outcomes.
What we offer:
  • Flexible work arrangements
  • Leave entitlements
  • Career development opportunities.

Additional Information:

Job Posted:
May 19, 2025

Expiration:
June 15, 2025

Employment Type:
Fulltime
Work Type:
On-site work
Job Link Share:
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