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Photonics Packaging Engineer

https://www.csiro.au/ Logo

CSIRO

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Location:
Australia, Brisbane

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Category:
Research and Development

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Contract Type:
Employment contract

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Salary:

96000.00 - 109000.00 AUD / Year

Job Description:

CSIRO’s Sustainable Mining Technologies research program aims to create a safer, more efficient, and environmentally responsible resources sector. The successful candidate will work on advanced photonic sensing systems tailored for mining and industrial environments, focusing on scalable packaging processes and optical assembly to enable technologies for real-world sensing applications.

Job Responsibility:

  • Contributing to the development of low-loss, low-cost, scalable photonic chip packaging solutions
  • Designing and developing new packaging processes and assembly approaches for silicon photonic chip system specifications
  • Operating electrical wire bonders, two-photon polymerisation lithography instruments, and die bonders/optical assembly instruments in a cleanroom environment
  • Maintaining cleanroom facilities and equipment in line with best practices, safety, and quality standards
  • Contributing to the development and implementation of standardized validation methodologies for fibre-coupled photonic chip packages
  • Designing and developing heterogeneous integration (HI) assembly processes for seamless photonic and electronic integration at the chip level
  • Performing Multiphysics modelling and simulations to optimize thermal, mechanical, and optical performance of integrated photonic assemblies using Ansys Lumerical and ZEMAX

Requirements:

  • Minimum qualification of a Master’s degree in Electrical Engineering, Physics (ideally majoring in Optics), Materials Science, Mechanical Engineering, or a related field
  • Demonstrated experience in scientific programming (MATLAB, LabVIEW, C++, or Python)
  • Direct experience with manufacturing methods for attaching optical fibres to semiconductor chips using active and passive alignment
  • Experience in semiconductor packaging technologies including die attach, wire bonding, flip-chip, and micro-optics
  • Demonstrated analytical and problem-solving skills
What we offer:
  • Flexible work arrangements
  • Up to 15.4% superannuation
  • Leave entitlements
  • Career development opportunities

Additional Information:

Job Posted:
May 19, 2025

Expiration:
June 15, 2025

Employment Type:
Fulltime
Work Type:
On-site work
Job Link Share:
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