This list contains only the countries for which job offers have been published in the selected language (e.g., in the French version, only job offers written in French are displayed, and in the English version, only those in English).
As a Packaging Structural Engineering intern, you will work in the Packaging R&D group on testing, modeling and simulation across semiconductor packaging, flash memory product, and host levels. In this position, you will fulfill tasks set out by supervisors to assist package and product designs, and materials/device characterization, particularly addressing mechanical design and structural reliability issues. You will learn and contribute to innovative solutions to meet increased demands for small form-factor packages with thinner chips, denser interconnects, higher power and more stringent reliability against harsh environment. This position will interface with package & product design, materials engineering, electrical and physical characterization, lab testing, failure analysis, assembly R&D, reliability and other process teams.
Job Responsibility:
Conducting simulation tasks of mechanical responses of IC package and flash products
Advancing simulation tools for multiscale, multiphysics problems leading to damage and fracture
Analyzing, documenting and reporting testing and simulation results
Proposing engineering solutions to existing and future challenges facing data storage industry
Requirements:
Current student, pursuing a Ph.D. degree in Mechanical Engineering or a relevant major graduating in 2027
Interest in microelectronics packaging industry
Proficient in CAD and CAE tools, and a programming language
Proficient in Microsoft Office applications
Demonstrated strong work ethics
Nice to have:
Exceptional written and verbal communication skill