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PCB Fabrication Process Engineer

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AMD

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Location:
United States , Austin

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Contract Type:
Not provided

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Salary:

200000.00 - 300000.00 USD / Year

Job Description:

We are looking for a talented and energetic Lead Printed Circuit Board (PCB) fabrication process engineer to complement the existing skillsets of our Platform development team. In this role, you will be responsible for driving PCB performance, quality and reliability specifications: including but not limited to high-speed signal & power integrity (SI/PI) optimized stacks and interconnect structures for volume manufacturing.

Job Responsibility:

  • Design high performance material stacks & complex via-structure interconnects to enable AMD's next generation of Datacenter GPU Platform PCBs
  • Effectively address/close Design for Manufacturing queries in a timely manner to mitigate fabrication yield issues & derisk on-schedule delivery of critical builds
  • Own the process qualification & adoption of PCB fabrication technologies required to address rapidly evolving Signal Integrity, Power Delivery, and Thermal-Mechanical related performance specifications
  • Define technology roadmaps, vendor engagements, and help implement robust architecture design practices for performance, cost, and manufacturability
  • Collaborate with silicon/package design, board engineering/layout, and other cross-functional teams to enable PCB solutions from package to system level
  • Contribute to overall Platform quality from conceptualization/feasibility planning stage through NPI & mass volume production ramp
  • Drive process improvements while executing fast time-to-market product delivery
  • Function decisively in a dynamic & fast-paced product development environment

Requirements:

  • Bachelor's degree in Engineering (Electrical/Computer/Mechanical/Chemical…etc.)
  • Strong background in high-speed design, robust strategies for PCIe & Memory routing, and optimal PCB material selection dependent on application end-use
  • Expertise in destructive and non-destructive PCB failure/root cause analyses using 3DXRM, SEM, Thermal analysis (DSC, DMA...etc.), and FTIR Spectroscopy
  • Familiarity with 2D/3D Allegro (or other) Stack Impedance and Loss simulation tools required for SI/PI-focused interconnect optimizations
  • Ability to write scripts in programming languages (i.e. Python, C/C++, MATLAB, etc.) for statistical data analysis & tool development
  • Excellent verbal & written communication skills at engineering and executive levels
  • Laboratory Acumen - Experience with Design of Experiments, instrumentation, data acquisition and analyses, including uncertainty analysis
  • PCB Manufacturing - Sound knowledge of design & fabrication guidelines, in-depth understanding of PCBA-related failure mechanisms including CAF, PTH/via cracking, pad cratering/solder ball stress, glass-stop & delamination risk and proven experience with volume manufacturing suppliers in Asia & North America

Nice to have:

Master's degree in Electrical/Electronics & Computer Engineering

Additional Information:

Job Posted:
April 16, 2026

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