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We are looking for a talented and energetic Lead Printed Circuit Board (PCB) fabrication process engineer to complement the existing skillsets of our Platform development team. In this role, you will be responsible for driving PCB performance, quality and reliability specifications: including but not limited to high-speed signal & power integrity (SI/PI) optimized stacks and interconnect structures for volume manufacturing.
Job Responsibility:
Design high performance material stacks & complex via-structure interconnects to enable AMD's next generation of Datacenter GPU Platform PCBs
Effectively address/close Design for Manufacturing queries in a timely manner to mitigate fabrication yield issues & derisk on-schedule delivery of critical builds
Own the process qualification & adoption of PCB fabrication technologies required to address rapidly evolving Signal Integrity, Power Delivery, and Thermal-Mechanical related performance specifications
Define technology roadmaps, vendor engagements, and help implement robust architecture design practices for performance, cost, and manufacturability
Collaborate with silicon/package design, board engineering/layout, and other cross-functional teams to enable PCB solutions from package to system level
Contribute to overall Platform quality from conceptualization/feasibility planning stage through NPI & mass volume production ramp
Drive process improvements while executing fast time-to-market product delivery
Function decisively in a dynamic & fast-paced product development environment
Requirements:
Bachelor's degree in Engineering (Electrical/Computer/Mechanical/Chemical…etc.)
Strong background in high-speed design, robust strategies for PCIe & Memory routing, and optimal PCB material selection dependent on application end-use
Expertise in destructive and non-destructive PCB failure/root cause analyses using 3DXRM, SEM, Thermal analysis (DSC, DMA...etc.), and FTIR Spectroscopy
Familiarity with 2D/3D Allegro (or other) Stack Impedance and Loss simulation tools required for SI/PI-focused interconnect optimizations
Ability to write scripts in programming languages (i.e. Python, C/C++, MATLAB, etc.) for statistical data analysis & tool development
Excellent verbal & written communication skills at engineering and executive levels
Laboratory Acumen - Experience with Design of Experiments, instrumentation, data acquisition and analyses, including uncertainty analysis
PCB Manufacturing - Sound knowledge of design & fabrication guidelines, in-depth understanding of PCBA-related failure mechanisms including CAF, PTH/via cracking, pad cratering/solder ball stress, glass-stop & delamination risk and proven experience with volume manufacturing suppliers in Asia & North America
Nice to have:
Master's degree in Electrical/Electronics & Computer Engineering