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Etched is hiring an experienced PCB DFM Engineer to own the interface between hardware design and PCB fabrication vendors. You will be responsible for ensuring that Etched's most complex board designs are manufacturable, driving DFM reviews, material selections, and stackup decisions that align design intent with fab capabilities. This includes high-layer-count boards, advanced materials, and tight tolerances across accelerator and power delivery applications. This is a highly cross-functional role, working closely with US-based hardware design teams, fab vendors, and manufacturing operations.
Job Responsibility:
Own PCB DFM. Review designs against fab vendor capabilities and drive closure on manufacturability issues
Work directly with PCB fabrication vendors to evaluate stackup options, lamination structures, material selections, and process constraints
Qualify new PCB materials, constructions, and form factors required for next-generation designs. Assess vendor readiness and risk
Communicate fab constraints and DFM feedback to US hardware design teams. Surface tradeoffs early to minimize design iterations
Ensure alignment between design specifications (impedance, layer counts, via structures, tolerances) and vendor manufacturing capabilities
Support NPI builds by coordinating with fab vendors on prototype and pilot lot execution, yield feedback, and process improvements
Requirements:
5+ years of experience in PCB fabrication engineering, DFM, or PCB process engineering
Deep knowledge of high-layer-count PCB fabrication, including lamination cycles, sub-laminations, sequential builds, HDI structures, and advanced via technologies
Experience working directly with PCB fab vendors on material selection, stackup development, and process qualification
Understanding of signal integrity and power delivery constraints that drive PCB design decisions
Strong communication skills across engineering and manufacturing teams, including experience working across time zones