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PCB Design for Manufacturing Engineer

Taiwan, Taipei · Job Posted February 18, 2026
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Job Description

Etched is hiring an experienced PCB DFM Engineer to own the interface between hardware design and PCB fabrication vendors. You will be responsible for ensuring that Etched's most complex board designs are manufacturable, driving DFM reviews, material selections, and stackup decisions that align design intent with fab capabilities. This includes high-layer-count boards, advanced materials, and tight tolerances across accelerator and power delivery applications. This is a highly cross-functional role, working closely with US-based hardware design teams, fab vendors, and manufacturing operations.

Job Responsibility

  • Own PCB DFM. Review designs against fab vendor capabilities and drive closure on manufacturability issues
  • Work directly with PCB fabrication vendors to evaluate stackup options, lamination structures, material selections, and process constraints
  • Qualify new PCB materials, constructions, and form factors required for next-generation designs. Assess vendor readiness and risk
  • Communicate fab constraints and DFM feedback to US hardware design teams. Surface tradeoffs early to minimize design iterations
  • Ensure alignment between design specifications (impedance, layer counts, via structures, tolerances) and vendor manufacturing capabilities
  • Support NPI builds by coordinating with fab vendors on prototype and pilot lot execution, yield feedback, and process improvements

Requirements

  • 5+ years of experience in PCB fabrication engineering, DFM, or PCB process engineering
  • Deep knowledge of high-layer-count PCB fabrication, including lamination cycles, sub-laminations, sequential builds, HDI structures, and advanced via technologies
  • Experience working directly with PCB fab vendors on material selection, stackup development, and process qualification
  • Understanding of signal integrity and power delivery constraints that drive PCB design decisions
  • Strong communication skills across engineering and manufacturing teams, including experience working across time zones

Nice to have

  • Advanced PCB materials (low-loss laminates, high-Tg materials, hybrid stackups)
  • Via-in-pad, backdrilling, and other advanced interconnect techniques
  • High-speed design requirements for 112G+ SerDes, HBM, or similar interfaces
  • PCB vendor qualification and audit processes
  • Server or datacenter hardware programs

What we offer

  • Competitive compensation packages, including generous equity packages
  • Comprehensive insurance coverage and other top-of-market benefits

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