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We are looking for a candidate who can manage and drive external packaging & assembly suppliers on delivering or exceeding target performance in New Product Introduction, Supplier Manufacturing Operations, Quality and Reliability issue free processes, and Pathfinding new capabilities. AMD's environment is fast paced, results oriented and built upon a legion of forward-thinking people with a passion for winning technology! The successful candidates must be a team player with a commitment to meeting deadlines, have a drive for solutions and an aptitude to thrive with the ability to work in a fast-paced multi-tasking environment. He or she would have in-depth technical knowledge, excellent cross functional project management skills, conflict management skills, strong interpersonal skills with good presentation & communication skills. Demonstrating strong leadership to excel in his/her work with minimum supervision and strong interest to develop a career in AMD.
Job Responsibility
Drive IC packaging initiatives from product qualification to production ramp for next generation Advance Packages
Collaborate with substrate and assembly suppliers to define process flow and process controls to enable high reliability manufacturing
Drive manufacturing process quality through FMEA and lead comprehensive reliability evaluations to determine the quality and reliability margin for the product
Using AI to drive data analytics program and detect manufacturing and product quality excursion to safeguard product quality
Research and develop solutions to enhance package reliability for end users
Innovate methods by applying AI agent to add more value to the product through optimizing product cost, yield and performance
Lead collaboration with suppliers to meet AMD's goals (cost, yield, quality and reliability) and continuous improvement activities
Lead investigations, risk assessments on quality activities including PCN, lot on holds, issues including MRB, customer complaints, RMA
Requirements
5+ years of hand on experience in end to end of CoWoS & Advanced Package assembly process
Strong knowledge in FMEA & Control Plan methodology
Strong knowledge in data analysis tools (JMP, Snowflake, Power BI…etc.)
Experience on substrate, bump and assembly integration
Familiar with tools (failure analysis knowledge, package reliability knowledge)
Supplier quality management experience and a deep understanding of problem-solving tools including 8D principle and statistical process control principles
Strong leadership and interpersonal skills with effective communication & presentation skills