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AMD Logo AMD · IT - Software Development

Packaging Engineer

Taiwan, Hsinchu · Job Posted June 16, 2026
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Job Description

This role is critical to sustaining ongoing deliverables and ensuring continuity of key activities, particularly in OSAT factory backend NPI bringup and production sustaining.

Job Responsibility

  • Manage New Product Introduction activities and Product Ramp Up monitoring for post-test processes by working closely with AMD internal stakeholders
  • Co-work with AMD internal stakeholders and drive risk assessment, processing requirement definition and qualification for new products and/or processes at external manufacturing facilities for Mark / Inspection / Pack
  • Depth and breadth of considerations and validation to allow seamless execution of new product bringup and LVM production ramp
  • Proactively communicate task assignments/status to responsible parties and ensure schedule control with quality validation
  • Manage external manufacturing sites to ensure parts are manufactured to product specifications and achievement of product manufacturing KPI
  • Drive external manufacturing sites on issue resolution / opportunities for improvement supporting on process improvement and quality enhancement
  • Drive external manufacturing sites on technical cause and improvement for quality excursion resolution feedback from end customers
  • Timely execution of projects and special work requests, with comprehensive reports and analysis
  • Manage and execute Engineering change management / change controls and BOM changes
  • Uses of AI tools in achieving Product Performance Optimization & Tuning, Supply Chain & Manufacturing Intelligence
  • Site support / Audit as needed with travel
  • Will be involved in regional vendor management
  • Assist in additional duties as needed by supervisor

Requirements

  • Min 8 years’ experience in Semiconductor packaging, focusing in the following areas - Test, Mark and Pack process with good knowledge of quality system
  • Strong technical knowledge on marking technology and vision inspection machine technology is an advantage
  • Experience in NPI / DFM and product shipping packaging qualification
  • Supplier management experience (OSAT) preferred
  • Experience with 8D problem solving techniques
  • Familiar with statistical control tools, DOE and JMP and basic Autocad
  • Use of AI tools (Example Copilot, Snowflake)
  • Bachelor/MS degree in Mechanical or Material or Manufacturing Engineering
  • Creative, highly motivated self-driven individual with the demonstrated ability to independently complete complex engineering tasks
  • Excellent cross functional project management, communication, and presentation skills
  • Good in writing and speaking in English & Mandarin
  • Bachelor/MS degree in Mechanical or Material or Chemical Engineering
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