Packaging Engineer

• Die Assembly & Bonding: Lead and optimize die bonding, flip chip (solder reflow, thermocompression, underfill), and wire/ribbon bonding processes for electronic and photonic dies (laser chips, PICs, photodetectors, driver ICs) using Si, SiN, InP, and TFLN dies, with focus on process control, placement accuracy, and CTE management
• Optical Alignment & Fiber Attach: Develop passive and active fiber attach processes achieving sub-micron alignment tolerances on single- and multi-mode fibers, including pigtailing, v-groove arrays, and epoxy qualification, with optical characterization of insertion loss and back-reflection
• Testing: Perform mechanical integrity tests (die/wire/fiber pull and shear) and module-level optical/electrical characterization
• support design of experiments (DoE), test automation, and fixture development for yield tracking
• Cross-Functional & Leadership: Collaborate with design teams to embed design-for-manufacturability (DFM) and design-for-testability (DFT) principles, mentor junior engineers, and communicate process results and qualification data to several teams within the company.

• Bachelor's or Master's degree in Electrical Engineering, Photonics, Materials Science, Applied Physics, Mechanical Engineering or a closely related field
• 5-10+ years of hands-on experience in optoelectronic or photonic module packaging in an R&D or production environment
• Demonstrated expertise in at least two of: die bonding (epoxy/solder), flip chip, wire bonding, or fiber attach/optical alignment
• Experience with module-level electrical and optical characterization and test
• Familiarity with cleanroom protocols, ESD handling, and semiconductor process environments
• Strong understanding of optical coupling physics, waveguide fundamentals, and single-mode fiber handling
• Experience with design of experiments (DoE), statistical process control (SPC), and failure analysis methodologies.

• Experience with hermetic packaging, encapsulated dies, or metal housing assembly
• Knowledge of photonic integrated circuits (Si, SiN, InP, and TFLN platforms) and their packaging challenges
• Experience with automated assembly equipment (die bonders, wire bonders, fiber attach machines, vision systems)
• Background in thermoelectric cooler (TEC) integration and thermal management of photonic modules
• Programming skills for test automation (Python, LabVIEW, MATLAB)
• Experience with 3D packaging, silicon photonics interposers, or wafer-level packaging (WLP).

Relocation Support Available