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Packaging Design Engineer

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AMD

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Location:
India , Hyderabad

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Category:
IT - Software Development

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Contract Type:
Employment contract

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Salary:

Not provided
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Job Description:

The AMD Adaptive and Embedded Computing Group is seeking an experienced and self-motivated package design engineer. As a key member of the Package group, you will work across chip, technology and systems teams to define cost effective and high performance solutions.

Job Responsibility:

  • Use Cadence tools for design, modeling and simulations
  • Work on DoE, keeping upto date DFM/DFR for the product designs
  • Package/PCB layout and proficient use of Cadence (Advanced Package Designer APD/SIP, PCB Editor) or Mentor Xpedition design tools
  • Building on design rules used in previous generations of high power, Gbps IO products
  • Use scripting languages (PERL, Python, TCL, Shell etc), efficient tools in Unix/Windows environment to develop automation methodology
  • Use analytical and simulation tools to document package/module design
  • Conduct routing, stack-up & component placement studies
  • Translate requirements for various device packaging
  • Collaborate with PCB Layout Engineers to optimize the package ballmap and chip team to optimize the die size
  • Develop scripts for checking package parameters across device families

Requirements:

  • Bachelor's or Master's degree in Engineering
  • Good understanding of various Organic/PCB technologies to interpret/negotiate layout guidelines
  • 4+ yrs of working experience of 2D/3D package electrical modeling tools, such as Cadence, Ansys, AutoCAD
  • Good knowledge of SerDes design and package/PCB layout constraints
  • Conduct package design reviews, working knowledge of Valor/Calibre
  • Mentor junior package designers in the group
  • Use scripting languages (PERL, Python, TCL, Shell etc)
  • Use analytical and simulation tools

Nice to have:

Cadence, Ansys, AutoCAD

Additional Information:

Job Posted:
May 05, 2026

Employment Type:
Fulltime
Work Type:
On-site work
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