CrawlJobs Logo

Npi Packaging Engineer

presto-eng.com Logo

Presto Engineering

Location Icon

Location:
France , Colombelles

Category Icon
Category:
IT - Software Development

Job Type Icon

Contract Type:
Not provided

Salary Icon

Salary:

Not provided
Save Job
Save Icon
Apply Position

Job Description:

We are looking for an experienced NPI Packaging Engineer to lead the technical development of high-performance, high-density semiconductor packaging solutions for Presto products. In this role, you will work across the full development cycle, from package concept and technology selection through design, validation, qualification, and handover to manufacturing. You will collaborate closely with internal teams and external OSAT partners to ensure robust, scalable, and cost-effective packaging solutions.

Job Responsibility:

  • Lead the technical development of advanced semiconductor package solutions for Presto products
  • Work closely with Chip Design, Application Engineering, Operations, and external OSAT partners across Europe, the US, and Asia
  • Evaluate packaging technologies and identify the best solutions to support the product roadmap
  • Drive package technology development with suppliers and manufacturing partners
  • Design wirebond, flip-chip, and embedded semiconductor packages, including back-end wafer process modifications, to meet form factor, electrical, and thermal targets
  • Improve design processes, tools, and methodologies to support efficient, right-first-time development
  • Maintain professional networks to stay current on packaging technologies and process developments across industry and academia
  • Support test teams and customers with package outline drawings, thermal models, application notes, and technical expertise
  • Review and report assembly data collection results for each package type

Requirements:

  • Master’s degree or higher in Electronics, Physics, Materials Science, Engineering, or a related discipline
  • Around 6 years of relevant experience in semiconductor packaging or NPI-related development
  • Proven experience with assembly flows for lead-frame packages such as DFN and QFN, as well as BGA, SiP, WLCSP, and advanced packages
  • Experience creating designs using supplier design rules and modern 3D CAD tools such as AutoCAD or similar
  • Strong understanding of thermal characterization for semiconductor packages
  • Ability to work effectively in cross-functional, global teams
  • Strong ownership, prioritization, and delivery mindset
  • Confident in preparing and presenting technical results to internal and external stakeholders
  • English proficiency sufficient to understand, communicate, speak, and write effectively

Nice to have:

  • Experience with 3D multiphysics simulation tools such as Cadence tools, ANSYS tools, or equivalent for thermal, electrical, and stress analysis
  • Experience with package qualification tests such as MSL, TC, HAST, and HTS according to JEDEC and related standards
  • Strong problem-solving ability using structured methods such as 8D and DOE
  • Experience with package layout design in Cadence Allegro X APD
  • Proficiency with Klayout
What we offer:
  • Become part of an international company with friendly, smart, and passionate colleagues and join a great workplace that is heavily invested in making everyone feeling valued, motivated
  • Keep on developing in your role with access to plenty of online learning offers, regular conversations with your manager, and an individual Personal Development Plan that aligns with your talent and ambitions

Additional Information:

Job Posted:
May 14, 2026

Employment Type:
Fulltime
Work Type:
On-site work
Icon
Presto Engineering - All Job Offers
Job Link Share:
Copy Link Icon
Facebook Icon Twitter Icon LinkedIn Icon

Looking for more opportunities? Search for other job offers that match your skills and interests.

Briefcase Icon

Similar Jobs for Npi Packaging Engineer

Junior NPI Project Manager

Provides support and/or lead teams through the Engineering development process a...
Location
Location
Puerto Rico , Aguadilla
Salary
Salary:
Not provided
https://www.hpe.com/ Logo
Hewlett Packard Enterprise
Expiration Date
Until further notice
Flip Icon
Requirements
Requirements
  • Bachelor's or Master's degree in Business Management, Engineering, Computer Sciences, or equivalent
  • PMP/PMI certification preferred
  • Typically 2-4 years experience
  • Experienced using project planning tools and software packages
  • Strong analytical and problem solving skills
  • Demonstrated experience coordinating and directing matrixed teams and resources
  • Ability to create and manage program schedules, budgets, and resource allocation plans
  • Excellent written and verbal communication skills
  • mastery in English and local language
  • Ability to effectively communicate program plans, proposals, and results
Job Responsibility
Job Responsibility
  • Manages and leads a program involving one or more functions and project teams to drive the engineering development and implementation process
  • Develops schedules, critical deliverables, budget, resource allocation plan
  • Coordinates activities of supporting project teams and internal and external development partners
  • tracks progress against established plan
  • Communicates program progress, escalations, and issue analysis to product stakeholders
  • Leads and provides guidance and mentoring to less-experienced staff members
What we offer
What we offer
  • Health & Wellbeing benefits
  • Personal & Professional Development programs
  • Unconditional Inclusion environment
  • Comprehensive suite of benefits supporting physical, financial and emotional wellbeing
  • Fulltime
Read More
Arrow Right

Engineering Program Manager

Provides support and/or lead teams through the Engineering development process a...
Location
Location
Puerto Rico , Aguadilla
Salary
Salary:
Not provided
https://www.hpe.com/ Logo
Hewlett Packard Enterprise
Expiration Date
Until further notice
Flip Icon
Requirements
Requirements
  • Bachelor's or Master's degree in Business Management, Engineering, Computer Sciences, or equivalent
  • PMP/PMI certification preferred
  • Typically 4-6 years experience
  • Experienced using project planning tools and software packages to create, manage, and track project results
  • Strong analytical and problem solving skills
  • Demonstrated experience coordinating and directing matrixed teams and resources
  • Ability to create and manage program schedules, budgets, and resource allocation plans
  • Excellent written and verbal communication skills
  • mastery in English and local language
  • Ability to effectively communicate program plans, proposals, and results, and negotiate options at management levels
Job Responsibility
Job Responsibility
  • Manages and leads a program involving one or more functions and project teams to drive the engineering development and implementation process for a subsystem or component of a product or service offering
  • Develops schedules, critical deliverables, budget, resource allocation plan, and other support requirements for assigned program
  • Coordinates activities of supporting project teams and internal and external development partners
  • tracks progress against established plan and makes decisions to alter or update schedule and resource allocation to meet product requirements and development schedule
  • Communicates program progress, escalations, and issue analysis to product stakeholders
  • collaborates with management and internal manufacturing and development partners to implement changes to product, process, or program plan to resolve escalated issues, produce solutions, and ensure adherence to budgets and established product roadmaps and schedules
  • Leads and provides guidance and mentoring to less-experienced staff members
What we offer
What we offer
  • Health & Wellbeing benefits
  • Personal & Professional Development programs
  • Unconditional Inclusion environment
  • Comprehensive suite of benefits supporting physical, financial and emotional wellbeing
  • Fulltime
Read More
Arrow Right

Manufacturing Engineer

The NPI PCBA Manufacturing Engineer/Process Engineer will perform DFM reviews an...
Location
Location
India , Bangalore
Salary
Salary:
Not provided
https://www.hpe.com/ Logo
Hewlett Packard Enterprise
Expiration Date
Until further notice
Flip Icon
Requirements
Requirements
  • B.Tech/B.E. or higher degree with at least 7-10 years of electronics manufacturing experience
  • Consistent track record in supporting new product development teams as an NPI mfg. engineer with responsibility for complex PCBA and/or PCB manufacturability
  • Requires confirmed knowledge of interconnect and electronic assembly applications and technologies including soldering, press fit, and rework with knowledge of IPC-A-610.
  • Understanding of complex failure mechanisms in PCBA process and or PCB fabrication and knowledge of standard failure analysis techniques (SEM, EDX, X-section, Die and Pry, CSAM)
  • Proven track record to work independently in a multifaceted growth environment
  • Language skills: English (proficient – verbal and written)
  • Excellent problem-solving/analytical skills with strong interest in collaboration
  • Practical skills including experience improving business processes
  • Test experience is a plus
  • Candidates with both OEM PCBA NPI development and EMS partner factory experience preferred
Job Responsibility
Job Responsibility
  • Support assigned NPI products as a key DFM engineer responsible for PCBA manufacturability including compliance with EMS or other DFM guidelines in areas including SMT, BGA repair processes, wave solder, press fit, component package and new part qualification
  • Work with signal integrity teams and PCB suppliers to develop PC board stack-ups
  • Performs DFM reviews of new designs in execution with responsibility for resolving PCBA and PCB manufacturability issues
  • Attends program teams, EMS partner reviews, DFM council or other meetings related to PCBA/PCB DFM issues
  • You should have solid understanding of interconnect, SMT, solder process/materials and new component packaging as it applies to PCBA manufacturing to improve designs for high yields and ease of assembly
  • In coordination with factory teams, monitors or develops DOE’s to identify and confirm process parameters related to PCBA
  • Manage/lead specific mfg. technology related projects as the need arises in collaboration with outside suppliers and internal subject matter authorities
  • Provide mentorship/support to quality and sustaining mfg. engineering teams for critical quality or manufacturing problems on assigned products
  • Initial setup of both new and existing product BOM structures
  • setup of new products for operation in the Juniper test environment
What we offer
What we offer
  • Health & Wellbeing
  • Personal & Professional Development
  • Unconditional Inclusion
  • Fulltime
Read More
Arrow Right

Head of Engineering

Location
Location
India , Hyderabad
Salary
Salary:
Not provided
https://www.randstad.com Logo
Randstad
Expiration Date
June 12, 2026
Flip Icon
Requirements
Requirements
  • 15+ years in engineering / industrialization / Design engineering / NPI (experience range flexible if fit is strong)
  • Demonstrated experience working with contract manufacturers and/or external supplier ecosystems
  • Track record of driving DFM/DFT/DFA changes and translating engineering designs into scalable production
  • Strong discipline in engineering change control (ECO/ECN) and engineering documentation
  • Experience driving supplier/CM performance through data, cadence, and problem-solving
  • Strong communicator who can serve as the primary liaison between India partners and Norway R&D
Job Responsibility
Job Responsibility
  • Own the industrialization pathway from Norway R&D to CM(s): prototype → pilot → ramp → stable serial production
  • Drive Engineering design/testability/serviceability improvements through Design for Manufacturing (DFM), Design for Test (DFT), and Design for Assembly (DFA)
  • Define manufacturing readiness criteria and ensure complete build packs (BOMs, drawings, work instructions, test specs, traceability requirements, packaging)
  • Fulltime
Read More
Arrow Right

Senior Engineer, Packaging Engineering

Sandisk understands how people and businesses consume data and we relentlessly i...
Location
Location
Malaysia , Batu Kawan
Salary
Salary:
Not provided
sandisk.com Logo
Sandisk
Expiration Date
Until further notice
Flip Icon
Requirements
Requirements
  • Masters/Degree in Mechatronic Engineering, Computer Engineering, Computer Science, Software Engineering, Electrical Engineering, Data Science, Artificial Intelligence, Machine Learning or a related technical field
  • Proficiency in statistical data analysis and process simulation software
  • Knowledge of statistical techniques in data science (regression, properties of distribution)
  • Knowledge in machine learning techniques (neural network, machine learning)
  • Knowledge in programming language (python, R) and database (SQL) to perform data mining and analysis
  • Strong analytic skills and problem-solving skills
  • Experience or academic projects related to manufacturing automation, MES integration, or factory data systems
  • Exposure to Industry 4.0 technologies, real-time dashboards, or digital transformation initiatives in manufacturing
  • Passionate about technology and continuous improvement in a factory environment
  • Strong communication and teamwork skills
Job Responsibility
Job Responsibility
  • Develop new process for NPI, transfer to HVM without major quality issues
  • Analyze and optimize existing manufacturing processes to enhance efficiency and product quality
  • Develop and implement process improvement initiatives using methodologies such as Six Sigma and Lean
  • Design and conduct experiments to troubleshoot process issues and validate improvements
  • Develop and maintain factory automation applications with modern frontend tools
  • Develop and optimize Oracle SQL and Microsoft SQL Server queries for data access and reporting
  • Integrate factory systems and manufacturing equipment via web services, API calls, or SECS/GEM communication protocols
  • Support fine-tuning of pre-trained models on domain-specific datasets using techniques or full model training
  • Support system troubleshooting, software testing, and debugging during deployment and production ramp-up
  • Collaborate closely with process, equipment, factory automation and IT teams to deliver robust and efficient automation, machine learning and AI solutions
  • Fulltime
Read More
Arrow Right

Senior Engineer, Packaging Engineering

Sandisk understands how people and businesses consume data and we relentlessly i...
Location
Location
Malaysia , Batu Kawan, Penang
Salary
Salary:
Not provided
sandisk.com Logo
Sandisk
Expiration Date
Until further notice
Flip Icon
Requirements
Requirements
  • Masters/Degree in Mechatronic Engineering, Computer Engineering, Computer Science, Software Engineering, Electrical Engineering, Data Science, Artificial Intelligence, Machine Learning or a related technical field
  • Proficiency in statistical data analysis and process simulation software
  • Knowledge of statistical techniques in data science (regression, properties of distribution)
  • Knowledge in machine learning techniques (neural network, machine learning)
  • Knowledge in programming language (python, R) and database (SQL) to perform data mining and analysis
  • Strong analytic skills and problem-solving skills
  • Experience or academic projects related to manufacturing automation, MES integration, or factory data systems
  • Exposure to Industry 4.0 technologies, real-time dashboards, or digital transformation initiatives in manufacturing
  • Passionate about technology and continuous improvement in a factory environment
  • Strong communication and teamwork skills
Job Responsibility
Job Responsibility
  • Develop new process for NPI, transfer to HVM without major quality issues
  • Analyze and optimize existing manufacturing processes to enhance efficiency and product quality
  • Develop and implement process improvement initiatives using methodologies such as Six Sigma and Lean
  • Design and conduct experiments to troubleshoot process issues and validate improvements
  • Develop and maintain factory automation applications with modern frontend tools
  • Develop and optimize Oracle SQL and Microsoft SQL Server queries for data access and reporting
  • Integrate factory systems and manufacturing equipment via web services, API calls, or SECS/GEM communication protocols
  • Support fine-tuning of pre-trained models on domain-specific datasets using techniques or full model training
  • Support system troubleshooting, software testing, and debugging during deployment and production ramp-up
  • Collaborate closely with process, equipment, factory automation and IT teams to deliver robust and efficient automation, machine learning and AI solutions
  • Fulltime
Read More
Arrow Right

Senior Engineer, Packaging Engineering

Develop new process for NPI, transfer to HVM without major quality issues. Analy...
Location
Location
Malaysia , Batu Kawan, Penang
Salary
Salary:
Not provided
sandisk.com Logo
Sandisk
Expiration Date
Until further notice
Flip Icon
Requirements
Requirements
  • Master's/Bachelor's Degree in Mechanical, Electrical, Electronics, Microelectronics, Mechatronics, Materials Science, or related engineering discipline
  • Proficiency in statistical data analysis and process simulation software
  • Strong attention to detail and commitment to achieving goals
  • Ability to adapt to changing priorities and work efficiently in a fast-paced environment
  • Strong troubleshooting and analytical skills with the ability to collect, organize, analyze, and understand problems and conceptualize solutions
  • Passion, determination to uncover the root cause and derive a long-term solution
  • Excellent communication and collaboration skills
  • Good at mind mapping and proficient in MS Excel, MS Project, and PowerPoint presentation
  • Understanding of SQL query writing (Oracle / Microsoft SQL Server) and JMP is a plus
  • Ability to communicate with different hierarchy levels from diverse geographical areas and cultures
Job Responsibility
Job Responsibility
  • Develop new process for NPI, transfer to HVM without major quality issues
  • Analyze and optimize existing manufacturing processes to enhance efficiency and product quality
  • Develop and implement process improvement initiatives using methodologies such as Six Sigma and Lean
  • Design and conduct experiments to troubleshoot process issues and validate improvements
  • Collaborate with cross-functional teams to drive continuous improvement projects
  • Monitor and analyze process data to identify trends and opportunities for enhancement
  • Develop and maintain process documentation, including standard operating procedures and work instructions
  • Ensure compliance with safety regulations and quality control standards
  • Participate in new product development and process scale-up activities
  • Provide technical support and training to production personnel
  • Fulltime
Read More
Arrow Right

Senior Microelectronics Process Engineer

We are seeking an industry expert to lead the process architecture and developme...
Location
Location
Canada , Kanata, ON
Salary
Salary:
Not provided
sanmina.com Logo
Sanmina
Expiration Date
Until further notice
Flip Icon
Requirements
Requirements
  • Master’s Degree in Engineering (Materials, Electrical, Mechanical, or Physics)
  • Minimum 8+ years of direct, hands-on experience in microelectronics packaging and process engineering
  • Deep expertise in Flip Chip and Wire Bonding (Chip & Wire) processes
  • Strong understanding of material interactions, including underfills, epoxies, and gold-tin (AuSn) soldering/reflow processes
  • Proficiency in programming automated assembly equipment (pick-and-place, dispensers, wire bonders)
  • Demonstrated experience driving Engineering Change Orders (ECOs) and process qualifications
  • Strong background in statistical process control (SPC) and data analysis
Job Responsibility
Job Responsibility
  • Define the Strategy: Conceptualize and develop comprehensive assembly strategies for complex optoelectronic modules
  • Advanced Packaging Execution: Lead the hands-on development of critical process recipes, including Flip Chip, Underfill, Die Attach (epoxy & eutectic AuSn), and Wire Bonding (ball/wedge)
  • Equipment Leadership: Research, specify, and procure capital equipment. Oversee acceptance testing (SAT/FAT)
  • Design Partnership: Act as the primary feedback loop to the internal design team and external customers. Provide expert DFx (Design for Assembly/Manufacturing) guidance
  • Tooling & Fixturing: Conceptualize and drive the design of custom tooling and fixtures required for novel assembly techniques
  • Customer Interface: Serve as the primary technical liaison for customers during the development phase
  • Rigorous Methodology: Implement robust process controls using PFMEA and Control Plans
  • Root Cause Analysis: Lead complex troubleshooting efforts using methodical approaches (8D, etc.)
  • Documentation: Author and approve high-level process assembly documentation and process qualification reports
  • Technical Mentorship: Act as a subject matter expert and mentor to junior and intermediate engineers
What we offer
What we offer
  • Impact: Work on cutting-edge technologies that are shaping the future of connectivity
  • Growth: A visible role with the opportunity to shape the engineering culture and technical roadmap of the organization
  • Accommodations are available on request for candidates taking part in all aspects of the selection process
  • Fulltime
Read More
Arrow Right