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We are the global test and automation specialists, powering next-generation technologies through sophisticated solutions. Behind every electronic device you use, Teradyne's test technology ensures your device works right the first time, every time! Our portfolio of automation solutions help manufacturers to develop and deliver products quickly, efficiently and cost-effectively. Together, Teradyne companies deliver manufacturing automation across industries and applications around the world! Our Purpose TERADYNE, where experience meets innovation and driving excellence in every connection. We are fueled by creativity and diversity of thought and in our workforce. Our employees are supported to innovate and learn something new every day. We cultivate a culture of inclusion for all employees that respects their individual strengths, views, and experiences. We believe that our differences enable us to be a better team – one that makes better decisions, drives innovation and delivers better business results.Opportunity OverviewTeradyne’s Semiconductor Test Division develops the world’s leading equipment for testing electronics. Inside STD, our Operations New Product Introduction Group is looking for a dynamic, technically skilled Process Engineer to engage our Printed Circuit Board development space. This engineer will use their knowledge of PCBA’s to influence next-generation test instrument product designs from concept to volume release with DFM principles, create and run experiments, and support the development of new assembly processes.
Job Responsibility
Collaborate with Hardware Design on New Product initiatives, influencing Printed Circuit Board Assembly product development with Design for Manufacturability principles
Drive failure analysis for electrical components and PCBA solder defects
Develop and support Teradyne PCBA Design for Manufacturability guidelines and assembly best practices
Drive improvements and updates to NPI process documentation
Support Operations NPI objectives by executing component assessment, manufacturing process development, and fault-down activities for printed circuit board assemblies
Work with contract manufacturing teams to support new PCBA initial builds, experiments, and failure analysis
Lead NPI Lessons Learned activities, integrating feedback from high-volume manufacturing into NPI processes
Requirements
Bachelor’s Degree in Engineering (Manufacturing, Mechanical preferred)
2+ years in printed circuit board assembly and manufacturing