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Teradyne’s Semiconductor Test Division develops the world’s leading equipment for testing electronics. Inside STD, our Operations New Product Introduction Group is looking for a dynamic, technically skilled Process Engineer to engage our Printed Circuit Board development space. This engineer will use their knowledge of PCBA’s to influence next-generation test instrument product designs from concept to volume release with DFM principles, create and run experiments, and support the development of new assembly processes.
Job Responsibility:
Collaborate with Hardware Design on New Product initiatives, influencing Printed Circuit Board Assembly product development with Design for Manufacturability principles
Drive failure analysis for electrical components and PCBA solder defects
Develop and support Teradyne PCBA Design for Manufacturability guidelines and assembly best practices
drive improvements and updates to NPI process documentation
Support Operations NPI objectives by executing component assessment, manufacturing process development, and fault-down activities for printed circuit board assemblies
Work with contract manufacturing teams to support new PCBA initial builds, experiments, and failure analysis
Lead NPI Lessons Learned activities, integrating feedback from high-volume manufacturing into NPI processes
Requirements:
Bachelor’s Degree in Engineering (Manufacturing, Mechanical preferred)
2+ years in printed circuit board assembly and manufacturing